Microelectronics Reliability

Công bố khoa học tiêu biểu

Sắp xếp:  
Analytical study of a standby redundant intermittently working complex system
Microelectronics Reliability - Tập 10 - Trang 43-51 - 1971
C.P. Bajaj
A note on the statistics of reliability assessment
Microelectronics Reliability - Tập 13 - Trang 51-54 - 1974
L.W.F. Lukis
Gate defects analysis in AlGaN/GaN devices by mean of accurate extraction of the Schottky Barrier Height, electrical modelling, T-CAD simulations and TEM imaging
Microelectronics Reliability - Tập 76 - Trang 344-349 - 2017
J.G. Tartarin, O. Lazar, D. Saugnon, B. Lambert, C. Moreau, C. Bouexiere, E. Romain-Latu, K. Rousseau, A. David, J.L. Roux
Evaluating the moisture resistance of Y3Al5O12: Ce3+ phosphor used in high power white LED packaging
Microelectronics Reliability - Tập 121 - Trang 114130 - 2021
Weiyi Yuan, Jiajie Fan, Linjun Dong, Shanghuan Chen, Xuejun Fan, Guoqi Zhang
Modeling nonlinear moisture diffusion in inhomogeneous media
Microelectronics Reliability - Tập 75 - Trang 162-170 - 2017
Liangbiao Chen, Jiang Zhou, Hsing-wei Chu, Guoqi Zhang, Xuejun Fan
Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor
Microelectronics Reliability - Tập 137 - Trang 114742 - 2022
Daniel Riegel, Przemyslaw Jakub Gromala, Sven Rzepka
Stress/strain characterization in electronic packaging by micro-Raman spectroscopy: A review
Microelectronics Reliability - Tập 118 - Trang 114045 - 2021
Lulu Ma, Wei Qiu, Xuejun Fan
Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection
Microelectronics Reliability - Tập 70 - Trang 79-83 - 2017
A. Baı̈ri, Luís Roseiro, Alexander Martín-Garín, Kemi Adeyeye, José Antonio Millán García
Tensile characterization and constitutive modeling of sintered nano-silver particles over a range of strain rates and temperatures
Microelectronics Reliability - Tập 132 - Trang 114536 - 2022
Cheng Qian, Tijian Gu, Ping Wang, Wei Cai, Xuejun Fan, Guoqi Zhang, Jiajie Fan
Transient analysis on hygroscopic swelling characterization using sequentially coupled moisture diffusion and hygroscopic stress modeling method
Microelectronics Reliability - Tập 48 - Trang 805-810 - 2008
Jiang Zhou
Tổng số: 5,741   
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 575