Packaging influences on the reliability of MEMS resonators

Yan J, Seshia AA, Phan KL, Steeneken PG, van Beek JTM. Narrow bandwidth single-resonator MEMS tuning fork filter. In: Proceedings of IEEE international frequency control symposium joint with the 21st European frequency and time forum; 2007. p. 1366–9. Hsu WT, Pai M. The new heart beat of electronics – silicon MEMS oscillators. In: Proceedings of the 57th electronic components and technology conference; 2007. p. 1895–9. Steeneken PG, Ruigrok JJM, Kang S, van Beek JTM, Bontemps J, Koning JJ. Parameter extraction and support-loss in MEMS resonators. In: Comsol conference; 2007. Suijlen M. Ontwerp MEMS druksensor: rapport ontwerpproject NXP Nijmegen. Eindverslag ontwerpproject NXP Nijmegen; 2007. Voiculescu, 2005, Electrostatically actuated resonant microcantilever beam in CMOS technology for the detection of chemical weapons, IEEE Sensors J, 5, 641, 10.1109/JSEN.2005.851016 Jha CM, Bahl G, Melamud R, Chandorkar SA, Hopcroft MA, Kim B. Cmos-compatible dual-resonator MEMS temperature sensor with milli-degree accuracy. In: Proceedings of solid-state sensors, actuators and microsystems conference; 2007. p. 229–32. Zaman MF, Sharma A, Ayazi F. High performance matched-mode tuning fork gyroscope. In: Proceedings of the 19th IEEE international conference on micro electro mechanical systems; 2006. p. 66–9. Pourkamali, 2003, High-Q single crystal silicon HARPSS capacitive beam resonators with self-aligned sub-100-nm transduction gaps, J Microelectromech Syst, 12, 487, 10.1109/JMEMS.2003.811726 Zalalutdinov, 2003, Shell-type micromechanical actuator and resonator, Appl Phys Lett, 83, 3815, 10.1063/1.1622792 Chen, 2004, Mechanical issues of Cu-to-Cu wire bonding, IEEE Trans Compon Packaging Technol, 27, 539, 10.1109/TCAPT.2004.831745 van Driel, 2007, Mechanical reliability challenges for MEMS packages: capping, Microelectron Reliab, 47, 1823, 10.1016/j.microrel.2007.07.033 Yang DG, Bielen JA, Theunis F, van Driel WD, Zhang GQ. Die fracture probability prediction and design guidelines for laminate-based over-molded packages. In: Proceedings of EuroSimE 2008; 2008. p. 228–33. Zhang, 2006