Journal of Microelectromechanical Systems

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Direct silicon-silicon bonding by electromagnetic induction heating
Journal of Microelectromechanical Systems - Tập 11 Số 4 - Trang 285-292 - 2002
K. Thompson, Y.B. Gianchandani, J. Booske, R.F. Cooper
A novel heating technique, electromagnetic induction heating (EMIH), uses electromagnetic radiation, ranging in frequency from a few megahertz to tens of gigahertz, to volumetrically heat silicon above 1000/spl deg/C in only a few seconds. Typical power requirements fall between 900 to 1300 W for silicon wafers 75 to 100 mm in diameter. This technique has successfully produced direct silicon wafer...... hiện toàn bộ
#Electromagnetic induction #Electromagnetic heating #Electromagnetic radiation #Wafer bonding #Temperature #Frequency #Silicon on insulator technology #Manufacturing #Bonding processes #Furnaces
Wireless micromachined ceramic pressure sensor for high-temperature applications
Journal of Microelectromechanical Systems - Tập 11 Số 4 - Trang 337-343 - 2002
M.A. Fonseca, J.M. English, M. von Arx, M.G. Allen
In high-temperature applications, such as pressure sensing in turbine engines and compressors, high-temperature materials and data retrieval methods are required. The microelectronics packaging infrastructure provides high-temperature ceramic materials, fabrication tools, and well-developed processing techniques that have the potential for applicability in high-temperature sensing. Based on this i...... hiện toàn bộ
#Wireless sensor networks #Ceramics #Electromechanical sensors #Sensor phenomena and characterization #Information retrieval #Telemetry #Capacitive sensors #Turbines #Engines #Compressors
Equilibrium swelling and kinetics of pH-responsive hydrogels: models, experiments, and simulations
Journal of Microelectromechanical Systems - Tập 11 Số 5 - Trang 544-555 - 2002
Sudipto K. De, N. R. Aluru, Brian P. Johnson, Wendy C. Crone, David J. Beebe, Jeffrey S. Moore
Deformation and structural stability of layered plate microstructures subjected to thermal loading
Journal of Microelectromechanical Systems - Tập 11 Số 4 - Trang 372-384 - 2002
M.L. Dunn, Y. Zhang, V.M. Bright
We study the deformation and stability of gold-polysilicon MEMS plate microstructures fabricated by the MUMPS surface micromachining process and subjected to uniform temperature changes. We measured, using an interferometric microscope, full-field deformed shapes of a series of square and circular gold (0.5 /spl mu/m thick)/polysilicon (1.5 /spl mu/m thick) plate microstructures with characteristi...... hiện toàn bộ
#Structural engineering #Microstructure #Thermal loading #Temperature #Shape measurement #Thermoelasticity #Bifurcation #Stability #Micromechanical devices #Micromachining
VHF free-free beam high-Q micromechanical resonators
Journal of Microelectromechanical Systems - Tập 9 Số 3 - Trang 347-360 - 2000
Kun Wang, Ark-Chew Wong, Clark T.‐C. Nguyen
Quality factors in micron- and submicron-thick cantilevers
Journal of Microelectromechanical Systems - Tập 9 Số 1 - Trang 117-125 - 2000
Kevin Yasumura, T. D. Stowe, Eugene M. Chow, T. Pfafman, Thomas W. Kenny, B. C. Stipe, D. Rugar
Nonlinearity and hysteresis of resonant strain gauges
Journal of Microelectromechanical Systems - Tập 7 Số 1 - Trang 122-127 - 1998
Chengqun Gui, R. Legtenberg, H.A.C. Tilmans, J.H.J. Fluitman, Michael Curt Elwenspoek
A monolithic three-axis micro-g micromachined silicon capacitive accelerometer
Journal of Microelectromechanical Systems - Tập 14 Số 2 - Trang 235-242 - 2005
Junseok Chae, Haluk Külah, K. Najafi
New thermoelectric components using microsystem technologies
Journal of Microelectromechanical Systems - Tập 13 Số 3 - Trang 414-420 - 2004
H. Böttner, J. Nurnus, Alexander Gavrikov, Gerd Kühner, Martin Jägle, C. Kunzel, D. Eberhard, G. Plescher, Axel Schubert, K.-H. Schlereth
Electrostatic Comb Drive Levitation And Control Method
Journal of Microelectromechanical Systems - Tập 1 Số 4 - Trang 170-178 - 1992
William C. Tang, Martin Lim, Roger T. Howe
Tổng số: 51   
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