10.1016/0022-0248(93)90280-A
10.1016/0022-5096(96)00008-7
10.1557/PROC-428-463
10.1063/1.123722
10.1016/S0022-5096(99)00070-8
10.1016/0020-7683(90)90025-Q
10.1177/002199838101500207
10.1177/002199838101500207
hyer, 1982, the room-temperature shape of four-layer unsymmetric cross-ply laminates, J Compos Mater, 16, 318, 10.1177/002199838201600406
jones, 1999, Mechanics of Composite Materials
10.1098/rspa.1909.0021
dunn, 1999, nonlinear deformation of multilayer mems structures, Proc MEMS Symp, 75
10.1080/09500349514550341
10.1146/annurev.matsci.30.1.299
10.1117/12.397933
zhang, 2001, stress relaxation of gold/polysilicon layered mems microstructures subjected to thermal loading, Proc MEMS Symp ASME Int Mechanical Engineering Congress Exposition, 3, 149
harsh, 1998, flip-chip assembly for si-based rf mems, Proc 12th IEEE Int Conf Microelectromechanical Systems (MEMS `99), 273
10.1016/0022-5096(96)84548-0
10.1116/1.577260
10.1016/S0020-7683(97)00167-4
10.1117/12.284554
10.1063/1.365042
king, 1988, Materials Handbook for Hybrid Microelectronics
10.1016/0020-7225(93)90103-2
koester, 2001, MUMPs™ Design Rules
10.1016/0020-7683(94)00129-K
10.1115/1.2901570
10.1201/9781420050905.ch3
10.1109/84.623107