Institute of Electrical and Electronics Engineers (IEEE)

Công bố khoa học tiêu biểu

* Dữ liệu chỉ mang tính chất tham khảo

Sắp xếp:  
Evaluation of the Heat Transfer Coefficient in Microcircuits From the Frequency Analysis of the Thermal Transient Response
Institute of Electrical and Electronics Engineers (IEEE) - Tập 33 Số 2 - Trang 260-266 - 2010
T. Świątczak, Bjorn Vermeersch, Gilbert De Mey, B. Więcek, Jedrzej Banaszczyk, M. Felczak
Optimal Design Methodology of Plate-Fin Heat Sinks for Electronic Cooling Using Entropy Generation Strategy
Institute of Electrical and Electronics Engineers (IEEE) - Tập 27 Số 3 - Trang 551-559 - 2004
Chih‐Chin Shih, Genhao Liu
Design for manufacturability of SISE parallel plate forced convection heat sinks
Institute of Electrical and Electronics Engineers (IEEE) - Tập 24 Số 2 - Trang 150-158 - 2001
Madhusudan Iyengar, Avram Bar‐Cohen
Development of no-flow underfill materials for lead-free solder bumped flip-chip applications
Institute of Electrical and Electronics Engineers (IEEE) - Tập 24 Số 1 - Trang 59-66 - 2001
Z.Q. Zhang, S.H. Shi, Ching‐Ping Wong
Chemical kinetic model of interfacial degradation of adhesive joints
Institute of Electrical and Electronics Engineers (IEEE) - Tập 22 Số 2 - Trang 215-220 - 1999
D.C.C. Lam, Fan Yang, Pin Tong
Power and life extension of battery-ultracapacitor hybrids
Institute of Electrical and Electronics Engineers (IEEE) - Tập 25 Số 1 - Trang 120-131 - 2002
Roger A. Dougal, S. Liu, Ralph E. White
A precise numerical prediction of effective dielectric constant for polymer-ceramic composite based on effective-medium theory
Institute of Electrical and Electronics Engineers (IEEE) - Tập 23 Số 4 - Trang 680-683 - 2000
Ching‐Ping Wong, Thomas F. Marinis, Jianmin Qu, Yang Rao
Thermal compact modeling of parallel plate heat sinks
Institute of Electrical and Electronics Engineers (IEEE) - Tập 26 Số 1 - Trang 136-146 - 2003
Sridhar Narasimhan, Avram Bar‐Cohen, Rajesh V. Nair
Flow Boiling in a Micro-Channel Coated With Carbon Nanotubes
Institute of Electrical and Electronics Engineers (IEEE) - Tập 32 Số 3 - Trang 639-649 - 2009
Vikash Khanikar, Issam Mudawar, Timothy S. Fisher
Thermal Characteristics and Thermomechanical Reliability of Board-Level Stacked-Die Packages Subjected to Coupled Power and Thermal Cycling Test
Institute of Electrical and Electronics Engineers (IEEE) - Tập 31 Số 2 - Trang 495-502 - 2008
Tong‐Hong Wang, Chang-Chi Lee, Yi‐Shao Lai, Yu-Cheng Lin
Tổng số: 16   
  • 1
  • 2