Institute of Electrical and Electronics Engineers (IEEE)

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Evaluation of the Heat Transfer Coefficient in Microcircuits From the Frequency Analysis of the Thermal Transient Response
Institute of Electrical and Electronics Engineers (IEEE) - Tập 33 Số 2 - Trang 260-266 - 2010
T. Świątczak, Bjorn Vermeersch, Gilbert De Mey, B. Więcek, Jedrzej Banaszczyk, M. Felczak
Optimal Design Methodology of Plate-Fin Heat Sinks for Electronic Cooling Using Entropy Generation Strategy
Institute of Electrical and Electronics Engineers (IEEE) - Tập 27 Số 3 - Trang 551-559 - 2004
Chih‐Chin Shih, Genhao Liu
Design for manufacturability of SISE parallel plate forced convection heat sinks
Institute of Electrical and Electronics Engineers (IEEE) - Tập 24 Số 2 - Trang 150-158 - 2001
Madhusudan Iyengar, Avram Bar‐Cohen
Thermal compact modeling of parallel plate heat sinks
Institute of Electrical and Electronics Engineers (IEEE) - Tập 26 Số 1 - Trang 136-146 - 2003
Sridhar Narasimhan, Avram Bar‐Cohen, Rajesh V. Nair
Chemical kinetic model of interfacial degradation of adhesive joints
Institute of Electrical and Electronics Engineers (IEEE) - Tập 22 Số 2 - Trang 215-220 - 1999
D.C.C. Lam, Fan Yang, Pin Tong
Development of no-flow underfill materials for lead-free solder bumped flip-chip applications
Institute of Electrical and Electronics Engineers (IEEE) - Tập 24 Số 1 - Trang 59-66 - 2001
Z.Q. Zhang, S.H. Shi, Ching‐Ping Wong
Thermal Characteristics and Thermomechanical Reliability of Board-Level Stacked-Die Packages Subjected to Coupled Power and Thermal Cycling Test
Institute of Electrical and Electronics Engineers (IEEE) - Tập 31 Số 2 - Trang 495-502 - 2008
Tong‐Hong Wang, Chang-Chi Lee, Yi‐Shao Lai, Yu-Cheng Lin
Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly
Institute of Electrical and Electronics Engineers (IEEE) - Tập 29 Số 4 - Trang 864-868 - 2006
Yi‐Shao Lai, Tong‐Hong Wang, Ching-Chun Wang
Prognostics and health management of electronics
Institute of Electrical and Electronics Engineers (IEEE) - Tập 29 Số 1 - Trang 222-229 - 2006
Michael Pecht
A life consumption monitoring methodology for electronic systems
Institute of Electrical and Electronics Engineers (IEEE) - Tập 26 Số 3 - Trang 625-634 - 2003
Arun Ramakrishnan, Michael Pecht
Tổng số: 16   
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