Institute of Electrical and Electronics Engineers (IEEE)

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Evaluation of the Heat Transfer Coefficient in Microcircuits From the Frequency Analysis of the Thermal Transient Response
Institute of Electrical and Electronics Engineers (IEEE) - Tập 33 Số 2 - Trang 260-266 - 2010
T. Świątczak, Bjorn Vermeersch, Gilbert De Mey, B. Więcek, Jedrzej Banaszczyk, M. Felczak
Design for manufacturability of SISE parallel plate forced convection heat sinks
Institute of Electrical and Electronics Engineers (IEEE) - Tập 24 Số 2 - Trang 150-158 - 2001
Madhusudan Iyengar, Avram Bar‐Cohen
Chemical kinetic model of interfacial degradation of adhesive joints
Institute of Electrical and Electronics Engineers (IEEE) - Tập 22 Số 2 - Trang 215-220 - 1999
D.C.C. Lam, Fan Yang, Pin Tong
Development of no-flow underfill materials for lead-free solder bumped flip-chip applications
Institute of Electrical and Electronics Engineers (IEEE) - Tập 24 Số 1 - Trang 59-66 - 2001
Z.Q. Zhang, S.H. Shi, Ching‐Ping Wong
Power and life extension of battery-ultracapacitor hybrids
Institute of Electrical and Electronics Engineers (IEEE) - Tập 25 Số 1 - Trang 120-131 - 2002
Roger A. Dougal, S. Liu, Ralph E. White
Optimal Design Methodology of Plate-Fin Heat Sinks for Electronic Cooling Using Entropy Generation Strategy
Institute of Electrical and Electronics Engineers (IEEE) - Tập 27 Số 3 - Trang 551-559 - 2004
Chih‐Chin Shih, Genhao Liu
Thermal compact modeling of parallel plate heat sinks
Institute of Electrical and Electronics Engineers (IEEE) - Tập 26 Số 1 - Trang 136-146 - 2003
Sridhar Narasimhan, Avram Bar‐Cohen, Rajesh V. Nair
Flow Boiling in a Micro-Channel Coated With Carbon Nanotubes
Institute of Electrical and Electronics Engineers (IEEE) - Tập 32 Số 3 - Trang 639-649 - 2009
Vikash Khanikar, Issam Mudawar, Timothy S. Fisher
Thermal Characteristics and Thermomechanical Reliability of Board-Level Stacked-Die Packages Subjected to Coupled Power and Thermal Cycling Test
Institute of Electrical and Electronics Engineers (IEEE) - Tập 31 Số 2 - Trang 495-502 - 2008
Tong‐Hong Wang, Chang-Chi Lee, Yi‐Shao Lai, Yu-Cheng Lin
Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly
Institute of Electrical and Electronics Engineers (IEEE) - Tập 29 Số 4 - Trang 864-868 - 2006
Yi‐Shao Lai, Tong‐Hong Wang, Ching-Chun Wang
Tổng số: 16   
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