Thermal compact modeling of parallel plate heat sinks

Institute of Electrical and Electronics Engineers (IEEE) - Tập 26 Số 1 - Trang 136-146 - 2003
Sridhar Narasimhan1, Avram Bar‐Cohen1, Rajesh V. Nair2
1Department of Mechanical Engineering, University of Minnesota, MN, USA
2Fluent Inc., Lebanon, NH, USA

Tóm tắt

Từ khóa


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