Journal of Electronic Materials
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Processing and transport properties of high-Jc silver-clad Bi-2223 tapes and coils
Journal of Electronic Materials - Tập 22 - Trang 1295-1297 - 1993
The powder-in-tube process has been used to fabricate long lengths of flexible, high-Jc, silver-clad Bi-2223 HTS conductors. By improving thermomechanical processing and precursor powder preparation, we have succeeded in achieving Jc values of≥4×104 A/cm2 at liquid nitrogen (77K) temperature and >105 A/cm2 at liquid helium (4.2K) and liquid neon (27K) temperatures in short tape samples. Detailed m...... hiện toàn bộ
Aging Studies of Cu–Sn Intermetallics in Cu Micropillars Used in Flip Chip Attachment onto Cu Lead Frames
Journal of Electronic Materials - Tập 47 - Trang 1694-1704 - 2017
Copper micropillars plated onto a silicon die and soldered with Sn-Ag solder to a copper lead frame in a flip chip on lead package have been subjected to high-temperature storage at 150°C and 175°C for 500 h, 1000 h, and 1500 h. Cu6Sn5 and Cu3Sn intermetallic compounds were found on both sides of the solder, but the growth rates were not the same as evidenced by different values of the growth expo...... hiện toàn bộ
Structural, optical, and surface science studies of 4H-SiC epilayers grown by low pressure chemical vapor deposition
Journal of Electronic Materials - Tập 25 - Trang 917-923 - 1996
A series of epitaxial 4H-SiC thin films grown by low pressure chemical vapor deposition (LPCVD) were characterized using various techniques, including x-ray diffraction (XRD), Fourier transform infrared (FTIR) reflectance, Raman scattering, and x-ray photoelectron spectroscopy (XPS). The epilayers were grown on heavily doped n-type 4H-SiC substrates using different gas compositions. XRD showed tha...... hiện toàn bộ
InSb, GaSb, and GaInSb grown using trisdimethylaminoantimony
Journal of Electronic Materials - - 1995
Microstructure and Grain Orientation Evolution in Sn-3.0Ag-0.5Cu Solder Interconnects Under Electrical Current Stressing
Journal of Electronic Materials - Tập 44 - Trang 3880-3887 - 2015
In situ observation was performed on cross-sections of Sn-3.0Ag-0.5Cu solder interconnects to track the evolution of microstructure and grain orientation under electrical current stressing. Cross-sections of Cu/Ni–Sn-3.0Ag-0.5Cu–Ni/Cu sandwich-structured solder interconnects were prepared by the standard metallographic method and subjected to electrical current stressing f...... hiện toàn bộ
Synthesis and Characterization of Calcium Titanate-Filled Butyl Rubber Composites for Flexible Microwave Substrate Applications
Journal of Electronic Materials - Tập 52 - Trang 5022-5034 - 2023
Calcium titanate (CaTiO3)-filled butyl rubber (BR) composites were fabricated by mixing and hot pressing. The filler volume fraction was varied from 0 to 50%, and its effects on properties such as density, moisture absorption, dielectrics, coefficient of thermal expansion (CTE), thermal conductivity and thermal stability were studied. The phase purity of the powder was confirmed by x-ray diffracti...... hiện toàn bộ
Thermoelectric Properties of p-Type Mg2Si0.25Sn0.75 Doped with Sodium Acetate and Metallic Sodium
Journal of Electronic Materials - Tập 43 - Trang 1580-1584 - 2013
We have investigated the thermoelectric properties of p-type Na-doped Mg2 Si0.25Sn0.75 solid solutions prepared by liquid–solid reaction and hot-pressing methods. Na was introduced into Mg2Si0.25Sn0.75 by using either sodium acetate (CH3COONa) or metallic sodium (2 N). The samples doped with sodium acetate consisted of phases with antifluorite structure and a small amount of MgO as revealed by x-r...... hiện toàn bộ
Synthesis, Spectroscopy, Optical Characteristics and Parameters of Co(II), Pd(II) Complexes and Schiff Base Ligand
Journal of Electronic Materials - Tập 48 - Trang 7366-7371 - 2019
Schiff base ligand, (E)-methyl 2-(5-bromo-2-hydroxybenzylideneamino)-6-phenyl-4,5,6,7-tetrahydrobenzo[b]thiophene-3-carboxylate (L) generated from condensation of 5-bromo-salicylaldehyde with methyl 2-amino-6-methyl-4,5,6,7-tetrahydrothieno[2,3-c]pyridine-3-carboxylate and its Co(II) and Pd(II) metal complexes were prepared by using a molar ratio of ligand:metal as 1:1. The complex compounds were ...... hiện toàn bộ
A Novel Stress Characterization Technique for the Development of Low-Stress Ohmic Contacts to HgCdTe
Journal of Electronic Materials - Tập 38 Số 8 - Trang 1698-1706 - 2009
High mobility electron heterostructure wafer fused onto LiNbO3
Journal of Electronic Materials - - 2001
Tổng số: 10,926
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