Institute of Electrical and Electronics Engineers (IEEE)

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* Dữ liệu chỉ mang tính chất tham khảo

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Oxidation of Ruthenium
Institute of Electrical and Electronics Engineers (IEEE) - Tập 6 Số 1 - Trang 89-92 - 1983
Sanjeev Sharma, L. Hines
On the two modes of operation of monolithic Ag-C brushes
Institute of Electrical and Electronics Engineers (IEEE) - Tập 12 Số 2 - Trang 237-245 - 1989
D. Kuhlmann‐Wilsdorf, David D. Makel, N.A. Sondegaard, D. Maribo
Evaluation of Mechanical Properties of Thin Wires for Electrical Interconnections
Institute of Electrical and Electronics Engineers (IEEE) - Tập 6 Số 4 - Trang 494-502 - 1983
Simo‐Pekka Hannula, J. Wanagel, Che‐Yu Li
Enhancement of flip-chip fatigue life by encapsulation
Institute of Electrical and Electronics Engineers (IEEE) - Tập 14 Số 1 - Trang 218-223 - 1991
D. Suryanarayana, R. Hsiao, T.P. Gall, J.M. McCreary
Constitutive relations for tin-based solder joints
Institute of Electrical and Electronics Engineers (IEEE) - Tập 15 Số 6 - Trang 1013-1024 - 1992
Robert Darveaux, K. Banerji
Signature Analysis of Dispatch Schemes in Wafer Fabrication
Institute of Electrical and Electronics Engineers (IEEE) - Tập 9 Số 4 - Trang 518-525 - 1986
Judith E. Dayhoff, Robert W. Atherton
Factors Influencing Thin Gold Performance for Separable Connectors
Institute of Electrical and Electronics Engineers (IEEE) - Tập 4 Số 4 - Trang 499-508 - 1981
W. Reyes, E. Peter, G. Bolger, Cheng-Xun Sie
Boiling incipience and nucleate boiling heat transfer of highly wetting dielectric fluids from electronic materials
Institute of Electrical and Electronics Engineers (IEEE) - Tập 13 Số 4 - Trang 1032-1039 - 1990
Siming You, Avram Bar‐Cohen, Terrence W. Simon
Compliance metrics for the inclined gull-wing, spider J-bend, and spider gull-wing lead designs for surface mount components
Institute of Electrical and Electronics Engineers (IEEE) - Tập 14 Số 4 - Trang 771-779 - 1991
R.W. Kotlowitz, L.R. Taylor
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