Evaluation of Mechanical Properties of Thin Wires for Electrical Interconnections

Institute of Electrical and Electronics Engineers (IEEE) - Tập 6 Số 4 - Trang 494-502 - 1983
Simo‐Pekka Hannula1, J. Wanagel2, Che‐Yu Li2
1Cornell Univ. Ithaca, NY, USA
2Department of Materials Science and Engineering, Cornell University, Ithaca, NY, USA

Tóm tắt

Từ khóa


Tài liệu tham khảo

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Thông tin xuất bản

Institute of Electrical and Electronics Engineers (IEEE)

Tập 6 Số 4

494-502

Thông tin tác giả