27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
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Achieving a world record in ultra high speed wire bonding through novel technology
- Trang 342-347
The traditional wire bonder design employs a pivoting z-axis, which is mounted on an orthogonal x/y-stage. This type of system is now approaching its physical limitations. The new revolutionary and unique bond head design described in this paper uses entirely new kinematics, which allows for higher accelerations, as well as a stiff, light design. The vibrations, even at highest speed, can be reduc...... hiện toàn bộ
#Wire #Bonding #Acceleration #Costs #Permanent magnet motors #Magnetic fields #Flexible manufacturing systems #Semiconductor device manufacture #Flip chip #Standards development
Environmentally friendly, high thermal resistant, low CTE substrate material for semiconductor packaging
- Trang 389-390
Semiconductor packaging technology has been moving towards increased miniaturization, lighter weight and higher density. Flip Chip packaging is therefore becoming the mainstream packaging technology for next generation devices. The technology trend has been moving towards much finer pitch interconnections between the semiconductor chip and the package substrate, much narrower circuit width on the ...... hiện toàn bộ
#Thermal resistance #Substrates #Semiconductor materials #Semiconductor device packaging #Resins #Integrated circuit interconnections #Temperature #Gold #Materials reliability #Semiconductor device reliability
Bringing test to design: testing in the designer's event based environment
- Trang 372-375
In this paper, we present a new tester that works in the IC designer's simulation environment instead of traditional ATE test environment. The tester uses IC simulation data from a Verilog or VHDL simulator in the vcd format. The basic tester architecture and its operation are described.
#Circuit testing #Integrated circuit testing #Design engineering #Costs #Circuit simulation #Hardware design languages #Timing #Signal design #Integrated circuit modeling #Computer architecture
Novel techniques for wideband RF test
- Trang 423-425
Wireless communication systems continue to progress to wideband modulation formats. In particular, third generation (3G) wireless and wireless local area networks (WLAN) present extraordinary increases in channel bandwidth. As a result, designers are confronted with a greater divergence between the sinusoidal and modulated stimulus responses of a device. Traditional S-Parameter measurement techniq...... hiện toàn bộ
#Wideband #Radio frequency #Testing #Scattering parameters #Wireless LAN #Wireless communication #Modulation #Bandwidth #Measurement techniques #Narrowband
Ball shear versus ball pull test methods for evaluating interfacial failures in area array packages
- Trang 200-205
In this investigation, a ball pull (tensile) test is investigated as an alternative to the ball shear test for evaluating the solder joint integrity of area array packages. The relative effectiveness of the pull and shear methods is compared using BGA packages with documented susceptibility to brittle interfacial failure during accelerated temperature cycling tests or isothermal aging. Accelerated...... hiện toàn bộ
#Testing #Packaging #Soldering #Temperature #Accelerated aging #Isothermal processes #Failure analysis #Life estimation #Thermal degradation #Thermal conductivity
The use of pre-molded leadframe cavity package technologies in photonic and RF applications
- Trang 348-352
The development of both Opto "photonic" and RF technology into silicon based chip solutions is creating a demand for smaller, more cost effective solutions to house the devices. The suppliers of various cavity package options are now developing new designs to meet the cost and volume production demands generated by these emerging industries. Ceramic based parts are being developed to provide more ...... hiện toàn bộ
#Photonics #Radio frequency #Costs #Packaging machines #Plastic packaging #Silicon #Ceramics #Production equipment #Circuits #Lead compounds
A virtual prototyping test bed for electronics assembly
- Trang 130-135
This paper discusses PANDYA, which is a virtual prototyping test bed for electronics assembly. With the help of virtual reality based environments, product and process design issues can be studied. PANDYA facilitates identification of problems by enabling ideas to be proposed, studied, modified and validated. Such an approach reduces the overall product development time, reduces overall cost and i...... hiện toàn bộ
#Electronic equipment testing #Virtual prototyping #Assembly #Process design #Design engineering #Virtual reality #Product development #Virtual environment #Manufacturing processes #Product design
Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (Cat. No.02CH37299)
- 2002
Presents the front cover of the proceedings record.
Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package
- Trang 274-284
Viscoplastic finite-element simulation methodologies were utilized to predict solder joint reliability for a same die size, stacked, chip scale, ball grid array package under accelerated temperature cycling conditions (-40C to +125C, 15 min ramps/15 min dwells). The effects of multiple die attach material configurations were investigated along with the thickness of the mold cap and spacer die. The...... hiện toàn bộ
#Finite element methods #Soldering #Fatigue #Acceleration #Temperature #Plastics #Capacitive sensors #Predictive models #Electronics packaging #Chip scale packaging
Adhesion and reliability of underfill/subtrate interfaces in flip chip BGA packages: metrology and characterization
- Trang 206-214
This paper discusses the methodologies of fracture mechanics that are used to study interfacial delamination by modeling delamination as a crack propagating along the interface between two materials. Specifically, adhesion and subcritical debonding at interface between silicon nitride passivated Silicon die and silica/alumina filled epoxy underfill are investigated. Adhesion was measured in terms ...... hiện toàn bộ
#Adhesives #Flip chip #Packaging #Metrology #Delamination #Strain measurement #Chemistry #Silicon compounds #Energy measurement #Environmental factors