Tạp chí khoa học

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium

Cơ quan chủ quản: Chưa có thông tin

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Experimental and computational modelling characterisation of fine particle Pb-free solder paste volumes for flip chip assembly applications

·Trang 304-309

G.J. Jackson, M.W. Hendriksen, H. Lu, N.N. Ekere

#Computational modeling #Flip chip #Assembly #Integrated circuit interconnections #Lead #Waste materials #Printed circuits #Manufacturing #Electronic waste #Printing

High reliability non-flow underfill material with filler loading

·Trang 85-87

S. Katsurayama, Y. Sakamoto

#Materials reliability #Copper #Packaging #Assembly #Flip chip #Cleaning #Curing #Resins #Moisture #Testing

Flux technology for lead-free alloys and its impact on cleaning

·Trang 316-322

Ning-Cheng Lee, M. Bixenman

#Environmentally friendly manufacturing techniques #Lead #Cleaning #Tin #Thermal stability #Zinc #Soldering #Atmosphere #Solids #Temperature

Characteristics of silver-plated film on the second wire bondability

·Trang 382-388

T.Y. Lin, K.L. Davison, W.S. Leong, S. Chua, O. Robin, Y.F. Yao, J.S. Pan, J.W. Chai, K.C. Toh, W.C. Tjiu

#Wire #Bonding #Rough surfaces #Surface roughness #Application specific integrated circuits #Atomic force microscopy #Atomic measurements #Force measurement #Transmission electron microscopy #US Department of Energy

A two-step process for achieving an open test-development environment

·Trang 403-406

H. Lam

#Costs #Semiconductor device testing #Semiconductor device manufacture #Automatic testing #System-on-a-chip #System testing #Electronic design automation and methodology #Test equipment #Semiconductor devices #Manufacturing industries

Inspection challenges of leadless packages

·Trang 418-422

R. Bertz, P. Leahy

#Inspection #Semiconductor device packaging #Lead compounds #Packaging machines #Manufacturing processes #Testing #Assembly #Costs #Performance evaluation #Surface-mount technology

Effect of flux quantity on Sn-Pb and Pb-free BGA solder shear strength

·Trang 229-237

M. Painaik, D.L. Santos, A.J. McLenaghan, P. Chouta, S.K. Johnson

#Soldering #Testing #Pollution measurement #Vehicles #Electronics packaging #Coordinate measuring machines #Measurement standards #Chip scale packaging #Lead #Pain

Effect of underfill fillet configuration on flip chip package reliability

·Trang 291-303

L. Nguyen, H. Nguyen

#Flip chip #Packaging #Wafer scale integration #Shape #Assembly #Curing #Semiconductor device modeling #Ceramics #Substrates #Acoustic testing

Decision support for test and debug areas in RF manufacturing

·Trang 136-139

S. Balasubramanian, J. Arbulich, J. Craik, K. Srihari

#Radio frequency #Manufacturing #Spatial databases #System testing #Medical services #Electronic equipment testing #Feedback #Process design #Real time systems #Software debugging

Semiconductor backend flip chip processing, inspection requirements and challenges

·Trang 18-22

R. Asgari

#Flip chip #Inspection #Process control #Quality assurance #Semiconductor device measurement #Semiconductor device packaging #Microassembly #Testing #Chip scale packaging #Electronics packaging