27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
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Các bài báo tiêu biểu
Ultra-low profile CSPs - new packaging solutions for 300 mm based high-speed, mobile and wireless memory applications
- Trang 173-176
The electronics industry shaped the 90s with exceptional progress in device- and packaging technology. Still the demand continues for lower cost, smaller size and more functionality. The recent deployment of 300 mm wafers, low k dielectrics and copper interconnects are the contribution from the waferfab. The response in the assembly and packaging area are more advanced packages like BGA, CSP, DCA ......
#Packaging machines #Assembly #Substrates #Chip scale packaging #Bonding #Microassembly #Electronics packaging #Process control #Thermal force #Investments
Solving wire bond process challenges for QFN packaging
- Trang 391-397
The introduction of quad flat non-leaded frames now provides manufacturers with an ability to significantly reduce the finished size of a surface mounted component. Component manufacturers have begun to convert many designs to quad flat non-leaded (QFN) format due to the significant cost savings provided. By widening the frame strip and increasing site density, manufacturers can process a larger n......
#Wire #Bonding #Packaging #Costs #Production #Surface finishing #Strips #Manufacturing processes #Assembly #Design optimization
Flux technology for lead-free alloys and its impact on cleaning
- Trang 316-322
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems, mainly for soldering and cleaning purpose. For most of the lead-free solders, paste handling is not an issue. Although dust has not settled yet, it becomes clear that the flux needed should have higher flux capacity, higher oxygen barrier capability, and higher thermal stability. Halide-containin......
#Environmentally friendly manufacturing techniques #Lead #Cleaning #Tin #Thermal stability #Zinc #Soldering #Atmosphere #Solids #Temperature
Reliability issues in direct chip attach assemblies using reflow or no-flow underfill
- Trang 73-77
The encapsulation or underfilling of flip chips is critical for the widespread success of flip-chip-on-board type assemblies. The use of an underfill reduces the stresses on the solder joints that result from the coefficient of thermal expansion (CTE) mismatch between the different materials. The mismatch in the CTE between the chip, solder joint, and the substrate influences the reliability of th......
#Assembly #Thermal stresses #Flip chip #Soldering #Lead #Materials reliability #Passivation #Encapsulation #Thermal expansion #Joining materials
Achieving higher margins by solving the mobile flash test challenge
- Trang 407-409
Manufacturers of flash memory are just beginning to realize the challenges that come with testing these devices. Given the low output current of sub-2 V devices, a significant issue is their limited ability to drive a capacitive load created by the test environment itself-due to high impedance. When it comes to speed test, the result can be that the test equipment characterizes the device as perfo......
#Flash memory #System testing #Circuit testing #Manufacturing #Performance evaluation #Nonvolatile memory #Batteries #Impedance #Switches #Digital cameras
Wafer level underfill - processing and reliability
- Trang 53-62
Underfill materials play a major role in the reliability of flip chip packages. These adhesives have been the subject of much research and development in the last few years, and improvement in material performance has been obtained. However, the assembly method still remains unchanged, with the underfill being dispensed at the individual die level after flip chip reflow. Even with the arrival of "......
#Flip chip #Assembly #Printing #Packaging #Coatings #Curing #Wafer scale integration #Thermal expansion #Chemicals #Semiconductor materials
Chip-in-polymer: volumetric packaging solution using PCB technology
- Trang 46-49
The new challenge is to incorporate not only passive components, but as well active circuitry (ICs) and the necessary thermal management. Ultra thin chips (i.e. silicon dies thinned down to <50/spl mu/m total thickness) lend themselves to reach these goals. Chips with that thickness can be embedded in the dielectric layers of modern laminate PCBs. Micro via technology allows one to contact the emb......
#Packaging #Thermal management #Silicon #Circuits #Dielectrics #Laminates #Integrated optics #Optical devices #Optical polymers #Contacts
A two-step process for achieving an open test-development environment
- Trang 403-406
For many of today's most advanced ICs and system-on-chip (SoC) devices, test costs have risen to as much as 50% of the total manufacturing cost. A major component of test cost is the time and resources required for test-program development. There are time-proven methods and test-development tools - both in-house and commercial - for translating a semiconductor device's functional events and scan p......
#Costs #Semiconductor device testing #Semiconductor device manufacture #Automatic testing #System-on-a-chip #System testing #Electronic design automation and methodology #Test equipment #Semiconductor devices #Manufacturing industries
Possibilities and limitations of no-flow fluxing underfill
- Trang 88-93
The performance of three developmental no-flow fluxing underfills was examined in a variety of reflow profiles. The underfills differed in regards to their resin system, fluxing agents and cure kinetics. The reflow profiles differed in regards to the ramp rate, soak time, soak temperature, time above liquidous and peak temperature. For each underfill and reflow profile combination, the performance......
#Assembly #Resins #Temperature #Kinetic theory #Polymers #Environmentally friendly manufacturing techniques #Lead #Additives #Throughput #Surface-mount technology
Requirement specifications for an enterprise level collaborative, data collection, quality management and manufacturing tool for an EMS provider
- Trang 140-148
Numerous software applications that serve as effective tools in solving localized issues for an electronics manufacturing service (EMS) provider are currently available. However, there are very few products available in the market for an EMS provider that offer an integrated solution to issues ranging from the production floor to supplier quality. Applications with features including that of manuf......
#Collaborative tools #Quality management #Medical services #Software tools #Application software #Pulp manufacturing #Monitoring #Personnel #Consumer electronics #Production