27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
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Wafer level underfill - processing and reliability
- Trang 53-62
Underfill materials play a major role in the reliability of flip chip packages. These adhesives have been the subject of much research and development in the last few years, and improvement in material performance has been obtained. However, the assembly method still remains unchanged, with the underfill being dispensed at the individual die level after flip chip reflow. Even with the arrival of "......
#Flip chip #Assembly #Printing #Packaging #Coatings #Curing #Wafer scale integration #Thermal expansion #Chemicals #Semiconductor materials
Electrical modeling and analysis of lead-bonded and wire-bonded /spl mu/BGA/sup /spl reg// packages for high-speed memory applications
- Trang 250-258
Lead-bonded /spl mu/BGA (/spl mu/BGA/sup /spl reg//) and wire-bonded /spl mu/BGA (/spl mu/BGA/sup /spl reg//-W) packages with flex- and laminate-based substrates have been developed for high-speed memory devices. This work presents the inductance, capacitance, and resistance values for lead-bonded and wire-bonded /spl mu/BGA packages obtained from simulation study to demonstrate and compare their ......
#Packaging #Bonding #Performance analysis #Analytical models #Scattering parameters #Insertion loss #Inductance #Capacitance #Electric resistance #Wire
Silicon thinning and stacked packages
- Trang 50-52
The market demand of mobile electronic appliances is for smaller, lightweight physical characteristics with greater functionality. This demand contributes to advances in packaging technology that require semiconductor devices to be thinner to meet size and high thermal reliability constraints. Even though the active layer of most devices amounts for only 5-10 microns (with some devices needing abo......
#Silicon #Electronic packaging thermal management #Semiconductor device packaging #Consumer electronics #Home appliances #Semiconductor devices #Semiconductor device reliability #Smart cards #Stress #Assembly
Requirement specifications for an enterprise level collaborative, data collection, quality management and manufacturing tool for an EMS provider
- Trang 140-148
Numerous software applications that serve as effective tools in solving localized issues for an electronics manufacturing service (EMS) provider are currently available. However, there are very few products available in the market for an EMS provider that offer an integrated solution to issues ranging from the production floor to supplier quality. Applications with features including that of manuf......
#Collaborative tools #Quality management #Medical services #Software tools #Application software #Pulp manufacturing #Monitoring #Personnel #Consumer electronics #Production
cLGA/spl reg/ sockets: qualification, production, and performance ready
- Trang 105-109
The paper describes a next-generation solution for land grid array interconnections. The patented cLGA/spl reg/ socket system is a low cost, high volume, conventional material construction product. The product's design and construction make it very stable in response to accelerated life testing, and its low profile yields superior high-speed electrical performance.
#Sockets #Production #Product design #Testing #Stress #Surface contamination #Assembly #LAN interconnection #Costs #Structural beams
Inspection challenges of leadless packages
- Trang 418-422
The advantages of leadless devices are many, but along with the new technology come new inspection challenges. This paper explores the post-singulation inspection challenges related to the implementation of leadless packages from the perspective of a user implementing a new packaging technology, as well as that of a supplier of inspection tools working to address unique challenges inherent in the ......
#Inspection #Semiconductor device packaging #Lead compounds #Packaging machines #Manufacturing processes #Testing #Assembly #Costs #Performance evaluation #Surface-mount technology
Gold stud bump in flip-chip applications
- Trang 110-114
As power requirements and operating frequencies increase, more and more designs will look toward ball bumps as an interconnect solution. While solder has traditionally been the incumbent material for these bumps, solder's limitations have become manufacturing and performance limitations. As a result, packaging designers are looking toward gold bumps as a strong contender in the first-level interco......
#Gold #Wire #Packaging #Bonding #Frequency #Integrated circuit interconnections #Lead #Inductance #Switches #Manufacturing
Optimizing wire bonding processes for maximum factory portability
- Trang 329-334
In today's market of finer pitch high-end semiconductor devices, wire bonder set-up time could become too long and expensive without factory specific tools and processes. Reducing set-up time reduces cost and increases efficiency by allowing higher machine utilization. One of the keys to improving machine set-up time is bonder-to-bonder portability. To meet this challenge, wire-bonding equipment i......
#Wire #Bonding processes #Production facilities #Tail #Electronics packaging #Packaging machines #Shape #Electrodes #Milling machines #Semiconductor devices
Ball shear versus ball pull test methods for evaluating interfacial failures in area array packages
- Trang 200-205
In this investigation, a ball pull (tensile) test is investigated as an alternative to the ball shear test for evaluating the solder joint integrity of area array packages. The relative effectiveness of the pull and shear methods is compared using BGA packages with documented susceptibility to brittle interfacial failure during accelerated temperature cycling tests or isothermal aging. Accelerated......
#Testing #Packaging #Soldering #Temperature #Accelerated aging #Isothermal processes #Failure analysis #Life estimation #Thermal degradation #Thermal conductivity
Chip scale packaging techniques for RF SAW devices
- Trang 63-66
Wafer-level and chip-scale packaging techniques have been developed for use with surface acoustic wave (SAW) devices. Both techniques incorporate a process for bonding a lithium tantalate RF SAW wafer to a mating wafer using adhesive. The package provides a low loss, hermetic environment for the SAW device resulting in a product size at least three times smaller than competitively packaged product......
#Chip scale packaging #Radio frequency #Surface acoustic wave devices #Wafer scale integration #Electronics packaging #Surface acoustic waves #Acoustic waves #Wafer bonding #Lithium compounds #Testing