27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
Cơ quản chủ quản: N/A
Các bài báo tiêu biểu
Effect of flux quantity on Sn-Pb and Pb-free BGA solder shear strength
- Trang 229-237
#Soldering #Testing #Pollution measurement #Vehicles #Electronics packaging #Coordinate measuring machines #Measurement standards #Chip scale packaging #Lead #Pain
Addressing emerging test challenges for multilevel signaling devices
- Trang 376-381
#Testing #Distortion measurement #Ethernet networks #Manufacturing #Production #Timing jitter #Signal generators #Frequency #Multimedia communication #Pulse modulation
Processing and reliability of flip chip with lead-free solders on halogen-free microvia substrates
- Trang 310-315
#Flip chip #Environmentally friendly manufacturing techniques #Lead #Assembly #Tin #Failure analysis #Costs #Laminates #Joining materials #Data analysis
Cost and manufacturing optimization of high performance communication hardware using a daughter module
- Trang 115-122
#Cost function #Manufacturing #Hardware #Application specific integrated circuits #Printed circuits #Routing #Switches #Silicon #Space technology #Internet
Overcoming the key barriers in 35 /spl mu/m pitch wire bond packaging: probe, mold, and substrate solutions and trade-offs
- Trang 177-182
#Wire #Packaging #Probes #Wafer bonding #Gold #Testing #Metallization #Circuits #Intermetallic #Safety
Inspection challenges of leadless packages
- Trang 418-422
#Inspection #Semiconductor device packaging #Lead compounds #Packaging machines #Manufacturing processes #Testing #Assembly #Costs #Performance evaluation #Surface-mount technology
A novel process for protecting wire bonds from sweep during molding
- Trang 335-341
#Protection #Wire #Bonding #Packaging #Life testing #Costs #Process design #Semiconductor device manufacture #Manufacturing industries #Gold
Managing test complexity through a comprehensive design-to-test strategy
- Trang 360-363
#Circuit testing #Integrated circuit testing #Logic testing #Integrated circuit manufacture #Manufacturing processes #Semiconductor device manufacture #Semiconductor device testing #Production #Design for testability #Process design
Novel techniques for wideband RF test
- Trang 423-425
#Wideband #Radio frequency #Testing #Scattering parameters #Wireless LAN #Wireless communication #Modulation #Bandwidth #Measurement techniques #Narrowband