27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
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Các bài báo tiêu biểu
Innovations in defluxing engineered chemistries for removing flux residue on back end solder reflowed bumped wafers
- Trang 67-72
The semiconductor industry is in the early stages of a once-in-a-generation packaging substitution. The primary substitution is surface mount packages to area array packages. Within area array packages, a secondary substitution is taking place which is the replacement of wire bonding with flip chip as the die level interface. Flip chip encompasses all bumping technologies that interface a semicond...... hiện toàn bộ
#Technological innovation #Chemistry #Semiconductor device packaging #Chemical technology #Cleaning #Flip chip #Electronics industry #Wafer scale integration #Wire #Wafer bonding
Ultra-low profile CSPs - new packaging solutions for 300 mm based high-speed, mobile and wireless memory applications
- Trang 173-176
The electronics industry shaped the 90s with exceptional progress in device- and packaging technology. Still the demand continues for lower cost, smaller size and more functionality. The recent deployment of 300 mm wafers, low k dielectrics and copper interconnects are the contribution from the waferfab. The response in the assembly and packaging area are more advanced packages like BGA, CSP, DCA ...... hiện toàn bộ
#Packaging machines #Assembly #Substrates #Chip scale packaging #Bonding #Microassembly #Electronics packaging #Process control #Thermal force #Investments
A study of solder paste release from small stencil apertures of different geometries with constant volumes
- Trang 159-165
Stencil printing is a critical first step in surface mount assembly. It is often cited that about 50% or more of the defects found in the assembly of PCBs are attributed to stencil printing (R. Clouthier, 1997). Manufacturing techniques for the assembly of certain flip chips, chip scale packages and fine pitch ball grid arrays are testing the limits of current stencil printing capabilities. A thor...... hiện toàn bộ
#Apertures #Geometry #Printing #Assembly #Manufacturing #Flip chip #Chip scale packaging #Electronics packaging #Testing #Printers
Characteristics of silver-plated film on the second wire bondability
- Trang 382-388
Strong bond between the gold wire and the silver-plated leadframe is significantly crucial for maintaining either bondability or reliability during IC (integrated circuit) manufacturing process and IC application in the fields. This study investigated the surface and grain structure of the silver-plated film on the copper leadframe in terms of surface roughness test by atomic force microscopy (AFM...... hiện toàn bộ
#Wire #Bonding #Rough surfaces #Surface roughness #Application specific integrated circuits #Atomic force microscopy #Atomic measurements #Force measurement #Transmission electron microscopy #US Department of Energy
Measurement challenges for on-wafer RF-SOC test
- Trang 353-359
With the wireless industry pushing towards higher levels of integration, with more system-in-a-package (SIP) and multi-chip module (MCM) technology, known-good-die testing of RF-SOC devices has emerged as the next test challenge. These devices have higher packaging costs compared to the traditional single die integrated circuits (ICs), and potential lower yields, since multiple dice are used. As a...... hiện toàn bộ
#Circuit testing #System testing #Costs #Radio frequency #Probes #Integrated circuit packaging #Manufacturing #Bluetooth #Modems #Semiconductor device measurement
Techno-economic analysis of competing IC packaging protocols
- Trang 426-428
Comparing alternative packaging technologies is a complex task, involving prioritization of cost, performance, and business strategy issues. This paper focuses on one portion of the decision-making equation - cost. Using a tool for assessing the manufacturing costs of electronic packaging, cost outlook scenarios for three advanced packaging technologies are analyzed and compared. The technologies ...... hiện toàn bộ
#Integrated circuit packaging #Protocols #Costs #Electronics packaging #Manufacturing #Wafer scale integration #Decision making #Equations #Chip scale packaging #Integrated circuit modeling
Achieving a world record in ultra high speed wire bonding through novel technology
- Trang 342-347
The traditional wire bonder design employs a pivoting z-axis, which is mounted on an orthogonal x/y-stage. This type of system is now approaching its physical limitations. The new revolutionary and unique bond head design described in this paper uses entirely new kinematics, which allows for higher accelerations, as well as a stiff, light design. The vibrations, even at highest speed, can be reduc...... hiện toàn bộ
#Wire #Bonding #Acceleration #Costs #Permanent magnet motors #Magnetic fields #Flexible manufacturing systems #Semiconductor device manufacture #Flip chip #Standards development
Encapsulation of 1-Up fpBGA from design to production
- Trang 183-189
The plastic near chip scale ball grid array (fpBGA) package has already begun to take over certain segments of the surface mount technology (SMT) industry, and its hold on the market is expected to continue growing over the next few years. A fpBGA in general, offers a smaller footprint than a QFP package with similar pin count. In addition, fpBGA significantly reduces the risk of component handlin...... hiện toàn bộ
#Encapsulation #Production #Electronics packaging #Surface-mount technology #Chip scale packaging #Plastic packaging #Electricity supply industry #Plastics industry #Power supplies #Noise reduction
A structured approach to lead-free IC assembly transitioning
- Trang 215-222
Market forces, trade restrictions, and customer perceptions rather than environmental realities have driven the lead-free movement. However, it cannot be turned around. Consequently, manufacturers, suppliers, and industry consortia have all been working towards a common acceptable drop-in replacement for the standard eutectic SnPb. Most U.S. and European groups support the use of SnAgCu alloys for...... hiện toàn bộ
#Environmentally friendly manufacturing techniques #Assembly #Semiconductor device manufacture #Semiconductor device packaging #Lead compounds #Manufacturing industries #Soldering #Production #Logistics #Pulp manufacturing
Flux-underfill compatibility and failure mode analysis in high yield flip chip processing
- Trang 78-84
The compatibility of flux and underfill material systems significantly contributes to the formation and growth of process-induced defects and further influences flip chip reliability. Various no-clean fluxes, along with a water-soluble flux used as the baseline, are tested with two fast flow, snap cure underfills. Liquid-to-liquid thermal shock and temperature and humidity tests are conducted to e...... hiện toàn bộ
#Failure analysis #Flip chip #Conducting materials #Materials reliability #Thermal conductivity #Electric shock #Temperature #Humidity #Materials testing #System testing