27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
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Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (Cat. No.02CH37299)
- 2002
Presents the front cover of the proceedings record.
Improving yield, productivity, and quality in test assembly and packaging through direct part marking and unit level traceability
- Trang 154-158
Identifying and tracking individual devices throughout test, assembly and
packaging using directly marked 2D data matrix symbols is a viable application
and the basis of several SEMI traceability standards. Recently, it has been
utilized more extensively in high-volume manufacturing. Advancements such as
package-less strip designs make traceability challenges more acute and lead to
the development...
#Productivity #Testing #Assembly #Packaging #Transmission line matrix methods #Manufacturing processes #Strips #Databases #Uninterruptible power systems #Marketing and sales
Environmentally friendly, high thermal resistant, low CTE substrate material for semiconductor packaging
- Trang 389-390
Semiconductor packaging technology has been moving towards increased
miniaturization, lighter weight and higher density. Flip Chip packaging is
therefore becoming the mainstream packaging technology for next generation
devices. The technology trend has been moving towards much finer pitch
interconnections between the semiconductor chip and the package substrate, much
narrower circuit width on the ...
#Thermal resistance #Substrates #Semiconductor materials #Semiconductor device packaging #Resins #Integrated circuit interconnections #Temperature #Gold #Materials reliability #Semiconductor device reliability
Reliability issues in direct chip attach assemblies using reflow or no-flow underfill
- Trang 73-77
The encapsulation or underfilling of flip chips is critical for the widespread
success of flip-chip-on-board type assemblies. The use of an underfill reduces
the stresses on the solder joints that result from the coefficient of thermal
expansion (CTE) mismatch between the different materials. The mismatch in the
CTE between the chip, solder joint, and the substrate influences the reliability
of th...
#Assembly #Thermal stresses #Flip chip #Soldering #Lead #Materials reliability #Passivation #Encapsulation #Thermal expansion #Joining materials
Flux-underfill compatibility and failure mode analysis in high yield flip chip processing
- Trang 78-84
The compatibility of flux and underfill material systems significantly
contributes to the formation and growth of process-induced defects and further
influences flip chip reliability. Various no-clean fluxes, along with a
water-soluble flux used as the baseline, are tested with two fast flow, snap
cure underfills. Liquid-to-liquid thermal shock and temperature and humidity
tests are conducted to e...
#Failure analysis #Flip chip #Conducting materials #Materials reliability #Thermal conductivity #Electric shock #Temperature #Humidity #Materials testing #System testing
Ultra-low profile CSPs - new packaging solutions for 300 mm based high-speed, mobile and wireless memory applications
- Trang 173-176
The electronics industry shaped the 90s with exceptional progress in device- and
packaging technology. Still the demand continues for lower cost, smaller size
and more functionality. The recent deployment of 300 mm wafers, low k
dielectrics and copper interconnects are the contribution from the waferfab. The
response in the assembly and packaging area are more advanced packages like BGA,
CSP, DCA ...
#Packaging machines #Assembly #Substrates #Chip scale packaging #Bonding #Microassembly #Electronics packaging #Process control #Thermal force #Investments
PATCHWORK smart power thick-film hybrids for automotive under hood applications
- Trang 35-40
PATCHWORK provides a high degree of integration combining logic and power on one
ceramic substrate to respond to customer-specific circuits with acceptable
engineering costs and short periods of development. The hybrids are reliable and
high-temperature resistant and can be manufactured at a fair market price. The
introduction of PATCHWORK combines Ag/Pd/Pt, copper and gold conductors, high
temper...
#Automotive engineering #Logic circuits #Ceramics #Substrates #Reliability engineering #Power engineering and energy #Costs #Integrated circuit reliability #Manufacturing #Copper
Possibilities and limitations of no-flow fluxing underfill
- Trang 88-93
The performance of three developmental no-flow fluxing underfills was examined
in a variety of reflow profiles. The underfills differed in regards to their
resin system, fluxing agents and cure kinetics. The reflow profiles differed in
regards to the ramp rate, soak time, soak temperature, time above liquidous and
peak temperature. For each underfill and reflow profile combination, the
performance...
#Assembly #Resins #Temperature #Kinetic theory #Polymers #Environmentally friendly manufacturing techniques #Lead #Additives #Throughput #Surface-mount technology
Inspection challenges of leadless packages
- Trang 418-422
The advantages of leadless devices are many, but along with the new technology
come new inspection challenges. This paper explores the post-singulation
inspection challenges related to the implementation of leadless packages from
the perspective of a user implementing a new packaging technology, as well as
that of a supplier of inspection tools working to address unique challenges
inherent in the ...
#Inspection #Semiconductor device packaging #Lead compounds #Packaging machines #Manufacturing processes #Testing #Assembly #Costs #Performance evaluation #Surface-mount technology
Wafer level underfill - processing and reliability
- Trang 53-62
Underfill materials play a major role in the reliability of flip chip packages.
These adhesives have been the subject of much research and development in the
last few years, and improvement in material performance has been obtained.
However, the assembly method still remains unchanged, with the underfill being
dispensed at the individual die level after flip chip reflow. Even with the
arrival of "...
#Flip chip #Assembly #Printing #Packaging #Coatings #Curing #Wafer scale integration #Thermal expansion #Chemicals #Semiconductor materials