27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
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Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (Cat. No.02CH37299)
- 2002
Presents the front cover of the proceedings record.
Experimental and computational modelling characterisation of fine particle Pb-free solder paste volumes for flip chip assembly applications
- Trang 304-309
Advanced flip-chip technology is the key technique used to achieve a high-density assembly of components onto printed circuit boards (PCB). Increasing demands are being made on electronics manufacturers to use flip chip components with greater input/output capabilities at pitches below 0.100 mm for their future applications. Furthermore, the advancement in this technology is challenged by the requ......
#Computational modeling #Flip chip #Assembly #Integrated circuit interconnections #Lead #Waste materials #Printed circuits #Manufacturing #Electronic waste #Printing
A two-step process for achieving an open test-development environment
- Trang 403-406
For many of today's most advanced ICs and system-on-chip (SoC) devices, test costs have risen to as much as 50% of the total manufacturing cost. A major component of test cost is the time and resources required for test-program development. There are time-proven methods and test-development tools - both in-house and commercial - for translating a semiconductor device's functional events and scan p......
#Costs #Semiconductor device testing #Semiconductor device manufacture #Automatic testing #System-on-a-chip #System testing #Electronic design automation and methodology #Test equipment #Semiconductor devices #Manufacturing industries
Semiconductor backend flip chip processing, inspection requirements and challenges
- Trang 18-22
With the growing acceptance of flip chip packaging comes product and processing complexity requiring unproved process control and quality assurance capabilities. This paper describes the inspection requirements and challenges associated with flip chip processing. 100% 3-D inspection has become an important and integral part of the flip chip back-end process at various stages. The two major areas t......
#Flip chip #Inspection #Process control #Quality assurance #Semiconductor device measurement #Semiconductor device packaging #Microassembly #Testing #Chip scale packaging #Electronics packaging
Novel techniques for wideband RF test
- Trang 423-425
Wireless communication systems continue to progress to wideband modulation formats. In particular, third generation (3G) wireless and wireless local area networks (WLAN) present extraordinary increases in channel bandwidth. As a result, designers are confronted with a greater divergence between the sinusoidal and modulated stimulus responses of a device. Traditional S-Parameter measurement techniq......
#Wideband #Radio frequency #Testing #Scattering parameters #Wireless LAN #Wireless communication #Modulation #Bandwidth #Measurement techniques #Narrowband
High density photolithographic Advanprobe/spl trade/ technology
- Trang 415-417
Wafer level probing trends push high speed and high parallelism to reduce test cost and improve productivity. This in turn challenges design and fabrication technology for probecard manufacturing. New technology and the incorporation of new fabrication processes are intuitive approaches to tackling these challenges. Photolithographic MEMS (micro-electrical-mechanical-system) technologies and micro......
#Contact resistance #Silicon #Chemical technology #Fabrication #Etching #Bonding #Electric resistance #Testing #Springs #Chemical compounds
Requirement specifications for an enterprise level collaborative, data collection, quality management and manufacturing tool for an EMS provider
- Trang 140-148
Numerous software applications that serve as effective tools in solving localized issues for an electronics manufacturing service (EMS) provider are currently available. However, there are very few products available in the market for an EMS provider that offer an integrated solution to issues ranging from the production floor to supplier quality. Applications with features including that of manuf......
#Collaborative tools #Quality management #Medical services #Software tools #Application software #Pulp manufacturing #Monitoring #Personnel #Consumer electronics #Production
Finite element analysis of novel substrate design for high performance and cost reduction stacked die CSP
- Trang 267-273
Tessera /spl mu/BGA is the only true CSP package that pass JEDEC level 1 qualification for high performance RAMBUS, DDR and Flash products. The Reduced Cost Chip Scale Package (RC/sup 2/SP) is currently under development by Meicer with two plus metal layers thin core rigid board for large panel processing to reduce cost. Competitive cost, technology and performance are essential to cost down for /......
#Finite element methods #Performance analysis #Costs #Chip scale packaging #Copper #Qualifications #Springs #Stability #Thermomechanical processes #Etching
The use of pre-molded leadframe cavity package technologies in photonic and RF applications
- Trang 348-352
The development of both Opto "photonic" and RF technology into silicon based chip solutions is creating a demand for smaller, more cost effective solutions to house the devices. The suppliers of various cavity package options are now developing new designs to meet the cost and volume production demands generated by these emerging industries. Ceramic based parts are being developed to provide more ......
#Photonics #Radio frequency #Costs #Packaging machines #Plastic packaging #Silicon #Ceramics #Production equipment #Circuits #Lead compounds
Wafer level underfill - processing and reliability
- Trang 53-62
Underfill materials play a major role in the reliability of flip chip packages. These adhesives have been the subject of much research and development in the last few years, and improvement in material performance has been obtained. However, the assembly method still remains unchanged, with the underfill being dispensed at the individual die level after flip chip reflow. Even with the arrival of "......
#Flip chip #Assembly #Printing #Packaging #Coatings #Curing #Wafer scale integration #Thermal expansion #Chemicals #Semiconductor materials