Co-simulation of dynamic compact models of packages with the detailed models of printed circuit boards
Tóm tắt
Presents an algorithm for the co-simulation of packages given with the RC compact models and the printed circuit boards. This enables on one hand the correct detailed consideration of the heat transfer in the board, on the other hand the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages is possible. The main advantage is that the methodology keeps the fastness and user friendliness of the board level solvers, while giving information also about the details of the temperatures within or at the surfaces of the packages.
Từ khóa
#Packaging #Printed circuits #Steady-state #Temperature #Frequency domain analysis #Heat transfer #Integrated circuit modeling #Equations #Laboratories #ImpedanceTài liệu tham khảo
10.1016/S0026-2714(99)00249-8
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