27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
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Managing test complexity through a comprehensive design-to-test strategy
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 360-363
Advances in design capabilities and process technologies enable semiconductor manufacturers to create increasingly sophisticated, high-speed integrated circuits with test requirements that seriously challenge traditional test methods and manufacturers' ability to achieve high volume, cost-effective production. To cope with increased test complexity, alternative approaches have largely focused in i...... hiện toàn bộ
#Circuit testing #Integrated circuit testing #Logic testing #Integrated circuit manufacture #Manufacturing processes #Semiconductor device manufacture #Semiconductor device testing #Production #Design for testability #Process design
A novel process for protecting wire bonds from sweep during molding
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 335-341
Wire bonding remains the lowest cost and most flexible method for interconnection of semiconductors. A major factor limiting the density of this widely used interconnect technology is wire sweep during the molding processes. Design rules for wire length, wire diameter and bond pad pitch are in many cases constrained by the need to avoid sweep, potentially compromising manufacturers' ability to kee...... hiện toàn bộ
#Protection #Wire #Bonding #Packaging #Life testing #Costs #Process design #Semiconductor device manufacture #Manufacturing industries #Gold
Overcoming the key barriers in 35 /spl mu/m pitch wire bond packaging: probe, mold, and substrate solutions and trade-offs
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 177-182
Historically, the predominant obstacle to reducing wire bond pitch has been the positional accuracy and repeatability of the force and ultrasonics of the wire-bonding machine. However as the minimum bond pitch moved below 60 /spl mu/m, new barriers have presented themselves. The barriers that are most frequently identified by semiconductor packaging engineers are those associated with probing the ...... hiện toàn bộ
#Wire #Packaging #Probes #Wafer bonding #Gold #Testing #Metallization #Circuits #Intermetallic #Safety
Laser processing - the future of HDI manufacturing
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 149-153
Conventional electronics manufacturing technologies have become unsuitable for high density interconnect structures (HDIS) due to processing limitations, lower manufacturing yields, higher production costs and limited flexibility. Laser processing is one suitable solution for manufacturing HDIS. This is supported by published reports that over 90% of all microvias in HDI PWBs and chip package subs...... hiện toàn bộ
#Manufacturing processes #Laser modes #Optical device fabrication #Production #Costs #Packaging #Diodes #Solid lasers #Pulp manufacturing #Electronics industry
Inspection challenges of leadless packages
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 418-422
The advantages of leadless devices are many, but along with the new technology come new inspection challenges. This paper explores the post-singulation inspection challenges related to the implementation of leadless packages from the perspective of a user implementing a new packaging technology, as well as that of a supplier of inspection tools working to address unique challenges inherent in the ...... hiện toàn bộ
#Inspection #Semiconductor device packaging #Lead compounds #Packaging machines #Manufacturing processes #Testing #Assembly #Costs #Performance evaluation #Surface-mount technology
Encapsulation of 1-Up fpBGA from design to production
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 183-189
The plastic near chip scale ball grid array (fpBGA) package has already begun to take over certain segments of the surface mount technology (SMT) industry, and its hold on the market is expected to continue growing over the next few years. A fpBGA in general, offers a smaller footprint than a QFP package with similar pin count. In addition, fpBGA significantly reduces the risk of component handlin...... hiện toàn bộ
#Encapsulation #Production #Electronics packaging #Surface-mount technology #Chip scale packaging #Plastic packaging #Electricity supply industry #Plastics industry #Power supplies #Noise reduction
cLGA/spl reg/ sockets: qualification, production, and performance ready
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 105-109
The paper describes a next-generation solution for land grid array interconnections. The patented cLGA/spl reg/ socket system is a low cost, high volume, conventional material construction product. The product's design and construction make it very stable in response to accelerated life testing, and its low profile yields superior high-speed electrical performance.
#Sockets #Production #Product design #Testing #Stress #Surface contamination #Assembly #LAN interconnection #Costs #Structural beams
High reliability non-flow underfill material with filler loading
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 85-87
The non-flow underfill (NUF) process is an important technology that can be used to reduce the cost of flip chip package assembly. NUF reduces the oxide layer on metal (e.g. bump or pad) and encapsulates the package during bump connection processes such as the reflow process. Generally, in order to achieve higher reliability, filler must be formulated into the underfill material. In the case of NU...... hiện toàn bộ
#Materials reliability #Copper #Packaging #Assembly #Flip chip #Cleaning #Curing #Resins #Moisture #Testing
Elimination of polyimide stress buffer on integrated circuits using advanced packaging materials
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 195-199
Polyimide is typically used as the final layer in silicon technology process integration. Its primary purpose is to protect the topside structures and relieve the interface of stresses introduced during and after encapsulation. However, developments in mold compound technology as well as in wafer fabrication techniques have caused the industry to re-evaluate the need for a polyimide stress buffer....... hiện toàn bộ
#Polyimides #Stress #Integrated circuit packaging #Integrated circuit technology #Fabrication #Surface topography #Silicon #Protection #Encapsulation #Textile industry
Electrical modeling and analysis of lead-bonded and wire-bonded /spl mu/BGA/sup /spl reg// packages for high-speed memory applications
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 250-258
Lead-bonded /spl mu/BGA (/spl mu/BGA/sup /spl reg//) and wire-bonded /spl mu/BGA (/spl mu/BGA/sup /spl reg//-W) packages with flex- and laminate-based substrates have been developed for high-speed memory devices. This work presents the inductance, capacitance, and resistance values for lead-bonded and wire-bonded /spl mu/BGA packages obtained from simulation study to demonstrate and compare their ...... hiện toàn bộ
#Packaging #Bonding #Performance analysis #Analytical models #Scattering parameters #Insertion loss #Inductance #Capacitance #Electric resistance #Wire
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