27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium

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Environmentally friendly, high thermal resistant, low CTE substrate material for semiconductor packaging
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 389-390
T. Baba
Semiconductor packaging technology has been moving towards increased miniaturization, lighter weight and higher density. Flip Chip packaging is therefore becoming the mainstream packaging technology for next generation devices. The technology trend has been moving towards much finer pitch interconnections between the semiconductor chip and the package substrate, much narrower circuit width on the ...... hiện toàn bộ
#Thermal resistance #Substrates #Semiconductor materials #Semiconductor device packaging #Resins #Integrated circuit interconnections #Temperature #Gold #Materials reliability #Semiconductor device reliability
Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (Cat. No.02CH37299)
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - 2002
Presents the front cover of the proceedings record.
Possibilities and limitations of no-flow fluxing underfill
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 88-93
J.M. Hurley, Xiaoyun Ye, T. Berfield
The performance of three developmental no-flow fluxing underfills was examined in a variety of reflow profiles. The underfills differed in regards to their resin system, fluxing agents and cure kinetics. The reflow profiles differed in regards to the ramp rate, soak time, soak temperature, time above liquidous and peak temperature. For each underfill and reflow profile combination, the performance...... hiện toàn bộ
#Assembly #Resins #Temperature #Kinetic theory #Polymers #Environmentally friendly manufacturing techniques #Lead #Additives #Throughput #Surface-mount technology
Semiconductor backend flip chip processing, inspection requirements and challenges
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 18-22
R. Asgari
With the growing acceptance of flip chip packaging comes product and processing complexity requiring unproved process control and quality assurance capabilities. This paper describes the inspection requirements and challenges associated with flip chip processing. 100% 3-D inspection has become an important and integral part of the flip chip back-end process at various stages. The two major areas t...... hiện toàn bộ
#Flip chip #Inspection #Process control #Quality assurance #Semiconductor device measurement #Semiconductor device packaging #Microassembly #Testing #Chip scale packaging #Electronics packaging
Decision support for test and debug areas in RF manufacturing
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 136-139
S. Balasubramanian, J. Arbulich, J. Craik, K. Srihari
The last few years have seen the rapid growth of products in the wireless segment. Electronic manufacturing services (EMS) providers have evolved to offer testing and box build services to their customers. Data management is vital in the test, debug and rework areas. Technicians who debug the board provide feedback vital for process and even design improvements. The DebugTech system was developed ...... hiện toàn bộ
#Radio frequency #Manufacturing #Spatial databases #System testing #Medical services #Electronic equipment testing #Feedback #Process design #Real time systems #Software debugging
Reliability issues in direct chip attach assemblies using reflow or no-flow underfill
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 73-77
V. Patwardhan, D. Blass, P. Borgesen, K. Srihari
The encapsulation or underfilling of flip chips is critical for the widespread success of flip-chip-on-board type assemblies. The use of an underfill reduces the stresses on the solder joints that result from the coefficient of thermal expansion (CTE) mismatch between the different materials. The mismatch in the CTE between the chip, solder joint, and the substrate influences the reliability of th...... hiện toàn bộ
#Assembly #Thermal stresses #Flip chip #Soldering #Lead #Materials reliability #Passivation #Encapsulation #Thermal expansion #Joining materials
Removable tape using thermoplastic adhesive for QFN assembly process
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 190-192
T. Kawai, T. Nagoya, H. Matsuura
The miniaturization of IC packages is progressing rapidly with the increasing demand for mobile electronic equipment. In particular, the demand for the QFN (quad flat non-leaded package), a lead frame type CSP, is increasing now. The productivity of the QFN assembly process can become much higher by using the MAP (molded array packaging) technology. In that technology, QFN support tape is a key ma...... hiện toàn bộ
#Assembly #Packaging machines #Electronic packaging thermal management #Productivity #Integrated circuit packaging #Electronic equipment #Chip scale packaging #Electronics packaging #Resins #Chemicals
cLGA/spl reg/ sockets: qualification, production, and performance ready
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 105-109
D. Neidich
The paper describes a next-generation solution for land grid array interconnections. The patented cLGA/spl reg/ socket system is a low cost, high volume, conventional material construction product. The product's design and construction make it very stable in response to accelerated life testing, and its low profile yields superior high-speed electrical performance.
#Sockets #Production #Product design #Testing #Stress #Surface contamination #Assembly #LAN interconnection #Costs #Structural beams
Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 274-284
B.A. Zahn
Viscoplastic finite-element simulation methodologies were utilized to predict solder joint reliability for a same die size, stacked, chip scale, ball grid array package under accelerated temperature cycling conditions (-40C to +125C, 15 min ramps/15 min dwells). The effects of multiple die attach material configurations were investigated along with the thickness of the mold cap and spacer die. The...... hiện toàn bộ
#Finite element methods #Soldering #Fatigue #Acceleration #Temperature #Plastics #Capacitive sensors #Predictive models #Electronics packaging #Chip scale packaging
A structured approach to lead-free IC assembly transitioning
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 215-222
L. Nguyen, R. Walberg, Z. Lin, T. Koh, Y.Y. Bong, M.C. Chua, S. Chuah, J.J. Yeoh
Market forces, trade restrictions, and customer perceptions rather than environmental realities have driven the lead-free movement. However, it cannot be turned around. Consequently, manufacturers, suppliers, and industry consortia have all been working towards a common acceptable drop-in replacement for the standard eutectic SnPb. Most U.S. and European groups support the use of SnAgCu alloys for...... hiện toàn bộ
#Environmentally friendly manufacturing techniques #Assembly #Semiconductor device manufacture #Semiconductor device packaging #Lead compounds #Manufacturing industries #Soldering #Production #Logistics #Pulp manufacturing
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