27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium

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Bringing test to design: testing in the designer's event based environment
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 372-375
R. Rajsuman
#Circuit testing #Integrated circuit testing #Design engineering #Costs #Circuit simulation #Hardware design languages #Timing #Signal design #Integrated circuit modeling #Computer architecture
Optimizing test strategies during PCB design for boards with limited ICT access
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 364-371
A. Verma
#Design optimization #Software testing #Design for testability #Software design #Production #Costs #Software tools #Design engineering #Software quality #Medical services
Pressfit technology for 3-D molded interconnect devices (MID) - A lead-free alternative to solder joints - challenges and solutions concepts
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 238-244
M. Eisenbarth, K. Feldmann
#Environmentally friendly manufacturing techniques #Lead #Soldering #Connectors #Crystalline materials #Temperature #Continuous production #Thermal stresses #Gases #Cleaning
Innovations in defluxing engineered chemistries for removing flux residue on back end solder reflowed bumped wafers
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 67-72
M. Bixenman
#Technological innovation #Chemistry #Semiconductor device packaging #Chemical technology #Cleaning #Flip chip #Electronics industry #Wafer scale integration #Wire #Wafer bonding
Environmentally friendly, high thermal resistant, low CTE substrate material for semiconductor packaging
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 389-390
T. Baba
#Thermal resistance #Substrates #Semiconductor materials #Semiconductor device packaging #Resins #Integrated circuit interconnections #Temperature #Gold #Materials reliability #Semiconductor device reliability
Flux technology for lead-free alloys and its impact on cleaning
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 316-322
Ning-Cheng Lee, M. Bixenman
#Environmentally friendly manufacturing techniques #Lead #Cleaning #Tin #Thermal stability #Zinc #Soldering #Atmosphere #Solids #Temperature
Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (Cat. No.02CH37299)
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - 2002
Characteristics of silver-plated film on the second wire bondability
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 382-388
T.Y. Lin, K.L. Davison, W.S. Leong, S. Chua, O. Robin, Y.F. Yao, J.S. Pan, J.W. Chai, K.C. Toh, W.C. Tjiu
#Wire #Bonding #Rough surfaces #Surface roughness #Application specific integrated circuits #Atomic force microscopy #Atomic measurements #Force measurement #Transmission electron microscopy #US Department of Energy
Gold stud bump in flip-chip applications
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 110-114
J. Jordan
#Gold #Wire #Packaging #Bonding #Frequency #Integrated circuit interconnections #Lead #Inductance #Switches #Manufacturing
PATCHWORK smart power thick-film hybrids for automotive under hood applications
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium - - Trang 35-40
P.K. Wilczek
#Automotive engineering #Logic circuits #Ceramics #Substrates #Reliability engineering #Power engineering and energy #Costs #Integrated circuit reliability #Manufacturing #Copper
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