International Journal of Adhesion and Adhesives

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Investigations on performance and failure mechanisms of high temperature thermoplastic polymers as adhesives
International Journal of Adhesion and Adhesives - Tập 70 - Trang 90-101 - 2016
Ajay Kumar Kadiyala, Jayashree Bijwe
The future use of structural adhesives in the construction of British Rail rolling-stock
International Journal of Adhesion and Adhesives - Tập 4 - Trang 17-21 - 1984
A. Seeds
Macroscopic and modern microscopic NDE methods for adhesive-bonded structures
International Journal of Adhesion and Adhesives - Tập 11 - Trang 5-10 - 1991
A.O.K. Nieminen, J.L. Koenig
Studies on pine bark extracts
International Journal of Adhesion and Adhesives - Tập 3 - Trang 31-35 - 1983
G. Weissmann
High-frequency welding of polypropylene using dielectric ceramic compounds in composite adhesive layers
International Journal of Adhesion and Adhesives - Tập 47 - Trang 57-62 - 2013
Masaru Sano, Hiroyuki Oguma, Masahiro Sekine, Chiaki Sato
Does acid etching prior to applying universal adhesives affect the bond strength of glass fiber post to root dentin?
International Journal of Adhesion and Adhesives - Tập 105 - Trang 102795 - 2021
Helder Callegaro Velho, Eduardo Trindade Dalence, Pablo Soares Machado, Marília Pivetta Rippe, Jovito Adiel Skupien, Vinícius Felipe Wandscher
Application of dielectric analysis for monitoring the cure process of phenol formaldehyde adhesive
International Journal of Adhesion and Adhesives - Tập 27 - Trang 562-567 - 2007
Milan Sernek, Frederick A. Kamke
Influence of the styrene content of thermoplastic styrene–butadiene rubbers in the effectiveness of the treatment with sulfuric acid
International Journal of Adhesion and Adhesives - Tập 21 - Trang 161-172 - 2001
Carmen M Cepeda-Jiménez, M Mercedes Pastor-Blas, T.P Ferrándiz-Gómez, J.M Martı́n-Martı́nez
Discoloration of transparent adhesives for building applications due to aging under solar exposure
International Journal of Adhesion and Adhesives - Tập 116 - Trang 103137 - 2022
Christiane Kothe, Jan Wünsch, Bernhard Weller
High conductivity of isotropic conductive adhesives filled with silver nanowires
International Journal of Adhesion and Adhesives - Tập 26 - Trang 617-621 - 2006
H.P. Wu, J.F. Liu, X.J. Wu, M.Y. Ge, Y.W. Wang, G.Q. Zhang, J.Z. Jiang
Tổng số: 1,774   
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