Synthesis and characterization of gold-containing oxides of K2NiF4 or Nd2CuO4 structure typeSpringer Science and Business Media LLC - Tập 51 - Trang 35-44 - 2018
Jerffersson Rodríguez Delgado, Verónica García Rojas, Gilles H. Gauthier
In this work, different materials of Nd2CuO4 and K2NiF4 Ruddlesden-Popper
structure have been prepared by solid-state reaction in air and high
temperatures. The powders of mixed oxides, of general formula La2Li0.5M0.5 − xAu
x O4 (M = Cu, Ni), were prepared from [Au(NH3)4](NO3)3 as gold source. The
stoichiometric proportions of the all reagents (including La2O3, NiCO3, CuO)
were grounded with a LiO... hiện toàn bộ
The sulphito complexes of goldSpringer Science and Business Media LLC - Tập 12 - Trang 90-95 - 1979
Paul C. Hydes, Harry Middleton
A new nitro-sulphito gold electrolyte has advantages over available commercial
sulphito electrolytes in terms of stability, simplicity of control and the
minimum non-porous deposit thickness. In describing its development, the authors
review what is known of gold sulphite complexes and their use in gold plating
baths.
Some thoughts on bondability and strength of gold wire bondingSpringer Science and Business Media LLC - Tập 45 - Trang 115-125 - 2012
Muhammad Nubli Zulkifli, Shahrum Abdullah, Norinsan Kamil Othman, Azman Jalar
The bonding mechanisms of gold, to give the desired strength of wire bonding,
still require detailed investigation, including establishing adequate and
reliable testing procedures. The current practices for analysing the mechanisms
of wire bonding are inadequate and do not provide a comprehensive picture. This
is because the focus of the tests is not clear, which causes variation in the
results ob... hiện toàn bộ
Scope for new applications for gold arising from the electrocatalytic behaviour of its metastable surface statesSpringer Science and Business Media LLC - Tập 37 - Trang 125-135 - 2004
Laurence D. Burke
The electrocatalytic behaviour of gold in aqueous media is surprisingly complex
and a novel view of gold electrode surfaces is proposed to explain the observed
electrochemical responses. The metal surface is considered as a chemically (or
redox) modified electrode, with equilibrated, low energy, surface gold atoms
functioning as a relatively inert support and low coverage, high energy,
protruding ... hiện toàn bộ
Gold plating in the electronics industrySpringer Science and Business Media LLC - Tập 12 - Trang 159-160 - 1979
J. W. Dini
Sur/Fin 79 — the Sixty-Sixth Annual Technical Conference of the American
Electroplaters’ Society was held in Atlanta, Georgia, on June 24th to 28th,
1979, Papers dealing with various aspects of gold plating were presented and are
summarized in this review.