Some thoughts on bondability and strength of gold wire bonding
Tóm tắt
The bonding mechanisms of gold, to give the desired strength of wire bonding, still require detailed investigation, including establishing adequate and reliable testing procedures. The current practices for analysing the mechanisms of wire bonding are inadequate and do not provide a comprehensive picture. This is because the focus of the tests is not clear, which causes variation in the results obtained, changing the conclusions about the responsible mechanism. Furthermore, as the size of Au wire bonds decreases, the mechanism responsible for thermosonic Au wire bonding may change. This paper provides a comprehensive analysis of the current and possible future methods for elaborating the bonding mechanism and strength of thermosonic Au wire bonds. We discuss the testing methods, their limitations and advantages, and suggest ways in which they can be improved.
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