Transistor width dependence of LER degradation to CMOS device characteristics

J. Wu1, Jihong Chen1, Kaiping Liu1
1Silicon Technology Development, Texas Instruments, Inc., Dallas, TX, USA

Tóm tắt

When transistor gate length is scaled down, the impact of transistor poly gate line edge roughness (LER) on device characteristics becomes significant. In this work, we study the dependence on transistor width of the low spatial frequency LER induced CMOS device Ion/Ioff degradations, based on TCAD simulation results and silicon data. Methodology to account for LER effects in device optimization is also discussed. We found that when the transistor width becomes comparable to the LER spatial period, the resulting transistor Ion/Ioff degradation presents a very different signature from that of wide transistor cases. We found that for narrow width transistors, the scatter clouds on the Ion/Ioff plot stretch out along the Ion/Ioff curve direction and compress vertically toward the ideal Ion/Ioff curve resulting in transistor parametric yield loss.

Từ khóa

#Degradation #Scattering #Clouds #Intrusion detection #Silicon #Frequency #Optimization methods #Shape #CMOS technology #Instruments

Tài liệu tham khảo

10.1109/55.924844 10.1109/SISPAD.2000.871225 yamaguchi, 0, Microprocesses and Nanotechnology '99, 158 linton, 1999, The impact of line edge roughness on 100nm device performance, IEEE Silicon Nanoelectronics Workshop, 82