The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition

Simon J, Zakel E, Reichl H. Electroless deposition of bumps for TAB technology. In: Electronic components and technology conference 1990. Proceedings of 40th, 20–23 May 1990. p. 412–7. Ostman A, Simon J, Reichl H. The pretreatment of aluminum bond pads for electroless nickel bumping. In: Multi-chip Module Conference, Proceedings of IEEE, 15–18 March 1993. p. 74–8. Chen, 2001, Electroless Ni–Cu–P barrier between Si/Ti/Al Pad and Sn–Pb flip chip solder bumps, IEEE Trans Compon, Packag Manufact Technol,, 24, 691, 10.1109/6144.974962 Kloeser J, Ostman A, Aschenbrenner R, Zakel E, Reichl H. Approaches to flipchip technology using electroless nickel-bumps. In: Electronic manufacturing technology symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International, December 1995. p. 60–8. Hutt, 2002, Electroless nickel bumping of aluminum bondpads—Part I: Surface pretreatment and activation, Electron Compon Packag Technol, 25, 87, 10.1109/6144.991180 Ng W-C, William C, Qi GJ. The effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging. In: Electronics packaging technology conference, 1998, Proceedings of 2nd, 8–10 December 1998. p. 89–94. ChingYau, 2004, Al pad surface morphology effect on flip–chip solder bump shear strength, Microelectron Reliab, 44, 323, 10.1016/S0026-2714(03)00159-8 Lee S-K, Jin J-G, Kim Y-H, Lee J-H. A study on the nucleation behavior of zinc particles on aluminum substrate. In: International symposium on electronics material and packaging, EMAP 2001, 19–22 November 2001. p. 73–8. Haydo J. Paneccasio Jr V, Cacciatore PA. Zincate Solutions for Treatment of Aluminum and Aluminum Alloys. US Patent Number 5,182,006, January 26,1993. Lin, 1996, The morphologies and the chemical states of the multiple zincating deposits on the Al pads of Si chips, Thin Solid Films, 288, 36, 10.1016/S0040-6090(96)08790-1 Strandford, 2002, Interconnecting to aluminum- and copper-based semiconductor (electroless-nickel/gold) for solder bumping and wire bonding, Microelectron Reliab, 42, 265, 10.1016/S0026-2714(01)00236-0 Jin, 2004, Adhesion improvement of electroless plated Ni layer by ultrasonic agitation during zincating process, Thin Solid Films, 466, 272, 10.1016/j.tsf.2004.02.100 Mei Z, Kaufmann M, Eslambolchi A, Johnson P. Brittle interfacial fracture of PBGA packages soldered on electroless nickel immersion golds. In: Electronic components and technology conference, Proceedings of 48th IEEE, 25–28 May 1998. p. 952–61. Xiong ZP, Osenbach John W, Lane Tok, Chua KH. Degradation of Pb/Sn balls on the electrolytic Ni/Au substrates as a results of post assembly heat treatments. In: Electronic packaging technology, 5th conference 2003, 10–12 December 2003. p. 176–82. Duan, 2003, The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low tempearature co-fired ceramic substrates, Microelectron Realib, 43, 1317, 10.1016/S0026-2714(03)00135-5 Lau, 2003