The effects of NO passivation on the radiation response of SiO2/4H-SiC MOS capacitors

Solid-State Electronics - Tập 46 - Trang 2231-2235 - 2002
Tianbing Chen1, Zhiyun Luo1, John D Cressler1, Tamara F Isaacs-Smith2, John R Williams2, Gilyong Chung3, Steve D Clark4
1Department of Electrical and Computer Engineering, Alabama Microelectronics Science and Technology Center, 200 Broun Hall, Auburn University, Auburn, AL 36849, USA
2Department of Physics, Auburn University, Auburn, AL 36849 USA
3Sterling Semiconductor, Tampa, FL 33619, USA
4NAVSEA Crane, Crane, IN 47522, USA

Tài liệu tham khảo

Baliga, 2001, The future of power semiconductor device technology, Proc. IEEE, 89, 822, 10.1109/5.931471 Baliga, 1998, High voltage silicon carbide devices, Proc. MRS Symp., 512, 77, 10.1557/PROC-512-77 Chung, 2000, Effect of nitric oxide annealing on the interface trap densities near the band edges in the 4H polytype of silicon carbide, Appl. Phys. Lett., 76, 1713, 10.1063/1.126167 Chung, 2001, Improved inversion channel mobility for 4H-SiC MOSFETs following high temperature anneals in nitric oxide, IEEE Electron. Dev. Lett., 22, 176, 10.1109/55.915604 Sheridan DC, Chuang GY, Clark S, Cressler JD. Effects of high-dose gamma irradiation on high voltage 4H-SiC schottky diodes and the SiC/SiO2 interface. IEEE Trans Nucl Sci 2001;48:2229–32 Shanfield, 1992, A new MOS radiation-induced charge: negative fixed interface charge, IEEE Trans. Nucl. Sci., 39, 303, 10.1109/23.277501 Schroder, 1998 Brady, 1990, A study of the effects of processing on the response of implanted buried oxides to total dose irradiation, IEEE Trans. Nucl. Sci., 37, 1995, 10.1109/23.101220