Tensile characterization and constitutive modeling of sintered nano-silver particles over a range of strain rates and temperatures

Microelectronics Reliability - Tập 132 - Trang 114536 - 2022
Cheng Qian1,2, Tijian Gu3, Ping Wang3, Wei Cai3, Xuejun Fan4, Guoqi Zhang5, Jiajie Fan1,2,6,5
1Institute of Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China
2Shanghai Engineering Technology Research Center for SiC Power Device, Fudan University, Shanghai 200433, China
3College of Mechanical and Electrical Engineering, Hohai University, Changzhou, 213022, China
4Department of Mechanical Engineering, Lamar University, Beaumont, TX 77710, USA
5EEMCS Faculty, Delft University of Technology, Delft 2628 CD, the Netherlands
6Research Institute of Fudan University in Ningbo, Ningbo 315336, China

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Microelectronics Reliability

Tập 132

114536

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