Study of PMMA thermal bonding
Tóm tắt
The bond strength dependence on bonding temperature and bonding pressure in traditional thermal bonding and surface modification bonding of PMMA is investigated. The results show that the bond strength of the latter bonding method is larger than the former. The effects of post-annealing and aging on bond strength are also demonstrated. Then the bonding parameters of temperature and pressure are optimized, and typical bond strength of 1 MPa is obtained at bonding temperature of 95°C, bonding pressure at 2 MPa, bonding time for 3 min and 50°C post-annealing for 2 h. The successful bonded microfluidic device was obtained through this optimized thermal bonding method.
Tài liệu tham khảo
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