Study of Inkjet-Printed Silver Films Based on Nanoparticles and Metal-Organic Decomposition Inks with Different Curing Methods

Micromachines - Tập 11 Số 7 - Trang 677
Peng Xiao1,2, Yicong Zhou1, Liao Gan3, Zhipeng Pan4, Jianwen Chen2, Dongxiang Luo5, Rihui Yao6,1, Jianqiu Chen1, Hongfu Liang1, Honglong Ning1
1Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China
2School of Physics and Optoelectronic Engineering, Foshan University, Foshan 528000, China
3Air Force Representative Office in Zunyi District, Zunyi 563000, China
4Guizhou Meiling Power Supply Co., Ltd., Zunyi 563000, China
5School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China
6Guangdong Province Key Lab of Display Material and Technology, Sun Yat-sen University, Guangzhou, 510275, China

Tóm tắt

Currently, inkjet printing conductive films have attracted more and more attention in the field of electronic device. Here, the inkjet-printed silver thin films based on nanoparticles (NP) ink and metal-organic decomposition (MOD) ink were cured by the UV curing method and heat curing method. We not only compared the electrical resistivity and adhesion strength of two types of silver films, but also studied the effect of different curing methods on silver films. The silver films based on NP ink had good adhesion strength with a lowest electrical resistivity of 3.7 × 10−8 Ω·m. However, the silver film based on MOD ink had terrible adhesion strength with a lowest electrical resistivity of 2 × 10−8 Ω·m. Furthermore, we found a simple way to improve the terrible adhesion strength of silver films based on MOD ink and tried to figure out the mechanisms. This work offers a further understanding of the different performances of two types of silver films with different curing methods.

Từ khóa


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Tập 11 Số 7

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