Solving wire bond process challenges for QFN packaging

E. McDivitt1
1Kulicke and Soffa, Willow Grove, PA, USA

Tóm tắt

The introduction of quad flat non-leaded frames now provides manufacturers with an ability to significantly reduce the finished size of a surface mounted component. Component manufacturers have begun to convert many designs to quad flat non-leaded (QFN) format due to the significant cost savings provided. By widening the frame strip and increasing site density, manufacturers can process a larger number of units through the production line and improve assembly efficiency. In addition, each unit occupies a smaller finished volume, reducing the amount of material and providing a cost savings per package. This paper discusses the challenges of wire bond for QFN package designs and describes how new wire bond capabilities and process optimization can improve production yields.

Từ khóa

#Wire #Bonding #Packaging #Costs #Production #Surface finishing #Strips #Manufacturing processes #Assembly #Design optimization

Tài liệu tham khảo

voss, 2001, Matrix Assembly and Test 0, VLSI RESEARCH INC