Solder joint fatigue models: review and applicability to chip scale packages
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Knecht, 1991, Integrated matrix creep: application to accelerated testing and lifetime prediction
Qian, 1998, On the life prediction and accelerated testing of solder joints, 1
Basaran, 1998, Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part 1: Theory and formulation, Journal of Electronic Packaging Transactions of the ASME, 120, 41, 10.1115/1.2792284
Basaran, 1998, Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part 2: Verification and application, Journal of Electronic Packaging Transactions of the ASME, 120, 48, 10.1115/1.2792285
Pao, 1992, A fracture mechanics approach to thermal fatigue life prediction of solder joints, IEEE Transactions on Components Hybrids, and Manufacturing Technology, 15, 559, 10.1109/33.159886
Bannantine, 1990, 59
Frear, 1991
Hall, 1991, Creep and stress relaxation in solder joints, 313
Kilinski, 1991, Modern approaches to fatigue life prediction of SMT solder joints
Dieter, 1986, 391
Dowling, 1993, 347
Barsom, 1977, 239
Pang, 1998, Thermo-mechanical analysis of solder joint fatigue and creep in a flip chip on board package subjected to temperature cycling loading, 878
Yeo, 1996, Solder joint reliability study of 256 Pin, 0.4 mm pitch, PQFP, 1222
Pang, 1997, Temperature cycling fatigue analysis of fine pitch solder joints, Advances in Electronic Packaging, 1495
Schubert, 1997, Thermo-mechanical reliability analysis of flip chip assemblies by combined microDAC and the finite element method, 1647
Gektin, 1997, Coffin-Manson based fatigue analysis of underfilled DCA, 1655
Hong, 1998, Integrated flow-thermomechanical and reliability analysis of a low air cooled flip chip-PBGA package, 1354
Iwasaki, 1997, Thermal fatigue analysis for solder bump in BGA packages, 1775
Rassaian, 1998, Multi-domain analysis of PBGA soder joints for structural design optimization, 1332
Syed, 1997, Factors affecting creep-fatigue interaction in eutectic Sn/Pb solder joints, 1535
Syed, 1996, Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages, 1211
Syed, 1998, Solder joint reliability of chip array BGA
Morris, 1997, The influence of microstructure on the mechanics of eutectic solders, 1529
Dasgupta, 1992, Solder creep-fatigue analysis by an energy-partitioning approach, ASME Journal of Electronic Packaging, 114, 152, 10.1115/1.2906412
Akay, 1997, Experimental correlations of an energy-based fatigue life prediction method for solder joints, 1567
Liang, 1997, An integrated fatigue life prediction methodology for optimum design and reliability assessment of solder interconnections, 1583
Wu, 1998, Reliability analysis for fine pitch BGA package, 737
Jung, 1997, Nonlinear analysis of full-matrix and perimeter plastic ball grid array solder joints, 1076
Lau, 1995
Gustafsson, 1998, Solder joint reliability of a lead-less RF-transistor, 87
Pan, 1994, Critical accumulated strain energy (case) failure criterion for thermal cycling fatigue of solder joints, Journal of Electronic Packaging, Transactions of the ASME, 116, 163, 10.1115/1.2905681
Bevan, 1997, Complex fatigue of soldered joints — comparison of fatigue models, 127
Solomon, 1995, Energy approach to the fatigue of 60/40 solder. Part 1: Influence of temperature and cycle frequency, Journal of Electronic Packaging, Transactions of the ASME, 117, 130, 10.1115/1.2792079
Solomon, 1996, Energy approach to the fatigue of 60/40 solder. Part 2: Influence of hold time and asymmetric loading, Journal of Electronic Packaging, Transactions of the ASME, 118, 67, 10.1115/1.2792134
Hall PM, Sherry WM. Materials, structures and mechanics of solder joints for surface-mount microelectronics technology. In: Lectures of the 3rd International Conference, vol. 102, 1986
Stolkarts, 1998, Constitutive and damage model for solders, 379
Mei, 1996, TSOP solder joint reliability, 1232
Lau, 1997, Reliability testing and data analysis, 38
Nguyen, 1998, Wafer level chip scale packaging — solder joint reliability, 868