Software simulation of the noise distribution in the chip
2002 IEEE International Symposium on Electromagnetic Compatibility - Tập 2 - Trang 692-695 vol.2
Tóm tắt
In this paper the problem of software simulation of the noise distribution in the chip has been considered. On the basis of earlier developed analytical equations the internal electromagnetic noise distribution in the chip with orthogonal and complanar topology of power supply feed have been obtained. These results can be useful to estimate the trends of the EM noise in the chip and evaluate the most critical area. Further, the developer can change the placing of the functional modules in the chip to increase the stability of the designed device to internal noises.
Từ khóa
#Military computing #Costs #Equations #Very large scale integration #Production facilities #Redundancy #Electromagnetic compatibility #Mathematical model #Computational modeling #Electromagnetic analysisTài liệu tham khảo
0, Symposia Records 1955 to 1995//Volume IEEE001 to IEEE004
vasiltsov, 2000, Estimation of the reliability of digital systems implemented on programmable devices, Microelectronics Reliability, Elsevier Science, 40, 2087
vasiltsov, 2001, The structure of the experimental device for investigation of the cryptanalysis on the basis of the apparatus failures, Proc of 5-th Intern Conf
ruehli, 2001, An Overview of Computer Modeling of Large EMC Chip and Package Problems, In Proc of 14-th Int Zurich Symposium on Electromagnetic Compatibility, 253
10.1109/ISEMC.2001.950728
vasiltsov, 2000, New 3d Model Of Internal Electromagnetic Noises In VLSI Chip, Proc 12th Int Wroclaw Symp Electromagn Compat, 55
steinecke, 2001, EMC Modeling and Simulation on Chiplevel, In Proc of Intern Symp On Electromagnetic Compatibility 2001 IEEE EMC, 1191, 10.1109/ISEMC.2001.950600
cass, 2002, New NASA Administrator Is Bush Insider, IEEE Spectrum, 39, 24, 10.1109/MSPEC.2002.8995695
vasiltsov, 2001, Investigation of the Internal Noises in the Chip with Orthogonal Topology of Power Supply Feeding, In Proc of Intern Symposium on Electromagnetic Compatibility 2001 IEEE EMC, 671
10.1109/MSPEC.2002.975031