Role of residual stress on crack penetration and deflection at a bimaterial interface in a 4-point bend test

Microelectronic Engineering - Tập 84 - Trang 72-79 - 2007
S. Roham1, T. Hight1
1Department of Mechanical Engineering, Santa Clara University, 500 El Camino Real, Santa Clara, CA 95053, USA

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