Microstructure evolution of eutectic Sn-Ag solder joints

Journal of Electronic Materials - Tập 23 Số 8 - Trang 765-772 - 1994
Wenge Yang1, Robert W. Messler1, L.E. Felton2
1Materials Engineering Department, Rensselaer Polytechnic Institute, Troy
2Design and Manufacturing Institute, Rensselaer Polytechnic Institute, Troy

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