Interface Structure And Strength Of Fluxless Ultrasonic Soldered Joints Of Magnesium Alloy
Tóm tắt
This study was performed to investigate the ultrasonic soldering of the magnesium alloy AZ31B in air, without using flux. A new type of Mg-AI-Zn-RE filler metal with a low melting point was developed, which enabled AZ31B to be soldered below 400 °C. The granular compound distributed in the filler metal may be Nd11Al3 intermetallic phase. The bonding strength of the lap-joint was measured and the microstructure of the joint was also analysed. When the ultrasonic vibration time was set to 3 s, the maximum bonding strength was 85 MPa. The microstructure of the soldered joint consisted mainly of α-Mg solid solution and Mg-Zn eutectic phases. The soldered joint also exhibited principally intergranular fracture mode. The corrosion behaviour of the soldered joint was also studied by electrochemical testing.
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