Influence of Surface Metal and Current Direction on Degradation Behavior of Sintered Silver Joint Under High-Density Current
Tóm tắt
To clarify potential issues that may arise in the future when high current densities are applied to joints in electronic power modules, high current density (25 kA/cm2) energization tests were conducted on sintered Ag joints sandwiched between Au and Ag layers. The degradation behavior differed depending on the current direction. The joint that placed the Au layer on the anode side showed a faster increase in voltage and temperature than the one placed on the Au layer at the cathode side, which also fractured at a much shorter energizing time (5 h). Generation and segregation of high-concentration coarse voids, in the same plane and growth of the Ag-Au solid solution layer, were observed in the sintered Ag layer of the joint, which placed the Au layer at the anode side before the fracture. Segregated voids existed near the cathode-side interface between the Ag layer and the surface of the base metal (Ti), and around the anode-side interface between the Ag layer and the Ag-Au solid solution layer. These results imply that the electromigration and diffusion coefficient imbalance between Ag and Au affect the behavior of the void generation and growth of the solid solution layer, which leads to a difference in the lifetime of the joints in the current direction under high current density energization. This indicates that the Au layer placed at the anode of the sintered Ag layer loses the reliability of the sintered Ag joints under the high current density driving electronic power modules.
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