High mobility electron heterostructure wafer fused onto LiNbO3
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J. Eymery, F. Fournel, F. Rieutord, D. Buttard, H. Moriceau, and B. Aspar, Appl. Phys. Lett. 75, 3509 (1999).
D. Buttard, J. Eymery, F. Rieutord, F. Fournel, D. Lübbert, T. Baumbach, and H. Moriceau, Phys. B 283, 103 (2000).
P.B. Howes, M. Benamara, F. Grey, R. Feidenhansl M. Nielsen, F.B. Rasmussen, and J. Baker, Phys. B 248, 74 (1998).
Q.Y. Tong and U. Gösele, Semiconductor Wafer Bonding (New York: Wiley, 1999).
M. Rotter, C. Rocke, S. Böhm, A. Lorke, A. Wixforth, W. Ruile, and L. Korte, Appl. Phys. Lett. 70, 2097 (1997).
B. Jenichen, V.M. Kaganer, A. Riedel, H. Kostial, Q. Gong, R. Hey, K.-J. Friedland, and K.H. Ploog, J. Appl. Phys. 89, 2173 (2001).