Flow and heat transfer simulation of injection molding with microstructures

Polymer Engineering and Science - Tập 44 Số 10 - Trang 1866-1876 - 2004
Liyong Yu1, L. James Lee1, Kurt W. Koelling1
1Dept. of Chemical Engineering, The Ohio State University, Columbus, OH 43210

Tóm tắt

AbstractInjection molding has been used for mass production of polymer products with microstructures. Conventional Hele‐Shaw 2.5D midplane simulation is unable to describe the flow pattern correctly. It tends to over‐predict the effects of microstructures on global flow patterns. For the unidirectional flow, an x‐z planar based on the general momentum equation is able to achieve better accuracy and to retrieve more detailed flow and heat transfer information around the microstructures. A hybrid numerical technique is developed, which can significantly reduce the nodes and computation time, and yet provide good flow simulation around the microstructures. The mold‐melt heat transfer coefficient and injection speed are shown to be very important factors in determining the filling depth in microstructures. A decrease of the heat transfer coefficient and the occurrence of wall‐slip are likely in microchannels. Polym. Eng. Sci. 44:1866–1876, 2004. © 2004 Society of Plastics Engineers.

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