Fabrication and characterization of flexible silicon substrates with electroplated gold leads
SENSORS, 2002 IEEE - Tập 1 - Trang 568-571 vol.1
Tóm tắt
A study was undertaken to fabricate flexible silicon substrates for high-density packaging. Two different fabrication methods were evaluated to obtain the best mechanical strength. To protect the structures from KOH etching an electroplated layer of nickel was used as protective layer. Structures are fabricated with electroplated gold leads to ensure low resistance.
Từ khóa
#Fabrication #Silicon #Gold #Stress #Probability #Etching #Protection #Acoustic beams #Materials testing #Force measurementTài liệu tham khảo
10.1557/S0883769400041646
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