Electrical stress effect on RF power characteristics of SiGe hetero-junction bipolar transistors
Tài liệu tham khảo
Burghartz, 1998, SiGe power HBT’s for low-voltage, high performance RF applications, IEEE Electron Dev Lett, 19, 103, 10.1109/55.663528
Zhenqiang, 2002, Si/SiGe/Si heterojunction bipolar transistor, IEEE Trans Microwave Theory Tech, 50, 1101, 10.1109/22.993412
Costou A, et al, Frequency synthesis from 2 to 30GHz using 0.35μm BiCMOS SiGe technology. In: Proc. 33rd European microwave conference, Munich; 2003. p. 395–395.
Mazouffre O, et al. A 23–24GHz low power frequency synthesizer in 0.25μm SiGe. In: Proc. 35th European microwave conference, Paris; 2005.
Vendrame, 2002, Degradation mechanism in polysilicon emitter bipolar junction transistors for digital application, Microelectron Reliab, 40, 207, 10.1016/S0026-2714(99)00217-6
Cressler, 1998, SiGe HBT technology: a new contender for Si-based RF and microwave circuit applications, IEEE Trans Microwave Theory and Techniques, 46, 572, 10.1109/22.668665
Tang, 1988, Junction degradation in bipolar transistors and the reliability imposed constraints to scaling and design, IEEE Trans Electron Dev, 35, 2101, 10.1109/16.8783
Neugroschel, 1995, Degradation of bipolar transistor current gain by hot holes during reverse emitter–base bias stress, IEEE Trans Electron Dev, 43, 1286, 10.1109/16.506781
Neugroschel, 1995, Current-acceleration for rapid time-to-failure determination of bipolar junction transistors under emitter–base reverse-bias stress, IEEE Trans Electron Dev, 42, 380, 10.1109/16.391226
Gogineni, 2000, Hot electron and hot hole degradation of UHV/CVD SiGe HBTs, IEEE Trans Electron Dev, 47, 1440, 10.1109/16.848289
Zhang, 2002, A new ‘mixed-mode’ reliability degradation mechanism in advanced Si and SiGe bipolar transistors, IEEE Trans Electron Dev, 49, 2151, 10.1109/TED.2002.805566
Zhu, 2003, An investigation of the damage mechanisms in impact ionization-induced “mixed-mode” reliability stressing of scaled SiGe HBTs, Int Electron Dev Meeting Tech Dig, 7.8.1
Cressler, 2004, Emerging SiGe HBT reliability issues for mixed-signal circuit applications, IEEE Trans Dev Mater Reliab, 222, 10.1109/TDMR.2004.826587
Carroll, 1997, Degradation of silicon bipolar junction transistors at high forward current density, IEEE Trans Electron Dev, 44, 110, 10.1109/16.554801
Huang, 2005, Hot-carrier induced degradations on RF power characteristics of SiGe heterojunction bipolar transistors, IEEE Trans Dev Mater Reliab, 183, 10.1109/TDMR.2005.846829
Peterson, 1985, Hot carrier effects in advanced self-aligned bipolar transistors, Int Electron Dev Meeting Tech Dig, 22
Chen, 2005, Linearity and Power Characteristics of SiGe HBTs at High Temperatures for RF Applications, IEEE Trans Electron Dev, 52, 1452, 10.1109/TED.2005.850633
Kim, 2002, Analysis of nonlinear behavior of power HBTs, IEEE Trans Microwave Theory Tech, 50, 1714, 10.1109/TMTT.2002.800396
Yang, 2001, Measurement of two-tone transfer characteristics of high-power amplifiers, IEEE Trans Microwave Theory Tech, 49, 568, 10.1109/22.910567
Iwamoto, 2000, Linearity characteristics of GaAs HBTs and the influence of collector design, IEEE Trans Microwave Theory Tech, 48, 2377, 10.1109/22.898987
McAndrew, 1996, VBIC95, the vertical bipolar inter-company model, IEEE J Solid-State Circuit, SC-31, 1476, 10.1109/4.540058
Gogineni, 1998, Comparison of current gain and low-frequency noise degradation by hot electrons and hot holes under reverse EB stress in UHV/CVD SiGe HBT’s, IEEE Bipolar/BiCMOS Circuits Technol Meeting, 172
Babcock, 1995, Correlation of low-frequency noise and emitter–base reverse-bias stress in epitaxial Si- and SiGe-base bipolar transistors, Int Electron Dev Meeting, 357, 10.1109/IEDM.1995.499214
Borgarino, 2001, Hot carrier effects in Si–SiGe HBTs, IEEE Trans Dev Mater Reliab, 1, 86, 10.1109/7298.956701
Kapoor, AK. Effect of emitter–base reverse bias stress on high frequency parameters of bipolar transistors. In: Proc IEEE IRPS Conference, 1991. p. 188–92.
Quon, 1994, Hot carrier induced bipolar transistor degradation due to base dopant compensation by hydrogen: Theory and experiment, IEEE Trans Electron Dev, 41, 1824, 10.1109/16.324594