Electrical impact of high-speed bus crossing plane split

The importance of providing a continuous return current path for high-speed signal design is well recognized. A signal bus crossing a plane split has negative impact on SI (signal integrity) and EMI (electromagnetic interference). This paper provides numerical and/or measurement analysis to quantify these effects in the PCB environment, such as waveform distortion, increased crosstalk levels, and excessive radiation. In addition, simulation is used to quantify the effectiveness of mitigation techniques resulting in high-speed bus design guidelines.