Effect of flux quantity on Sn-Pb and Pb-free BGA solder shear strength
Tóm tắt
The global movement to eradicate Pb from electronic assemblies has made it necessary to manufacture Pb-free packages. While the industry has identified potential Pb-free alternatives, much work still needs to be done in the component and board level reliability. Ball Grid Array (BGA) packages are commonly used in the electronics industry today. Flux deposition is a standard step in the BGA sphere-attach process and requires precise since it plays a critical role in the formation of the BGA solder joint. Flux measurement is difficult as it is clear or amber colored, thus making it invisible to standard optics techniques. The patent pending Ultraviolet Fluorescence Intensity Mapping (UV-FIM) technique is used in this research effort for flux measurement. BGA spheres are attached using different quantities of flux. A correlation is made between the solder joint shear strength and the flux quantity for Sn-Pb and Pb-free (96.5Sn-3.5Ag, 95.5Sn-4Ag-0.5Cu) BGA solder joints.
Từ khóa
#Soldering #Testing #Pollution measurement #Vehicles #Electronics packaging #Coordinate measuring machines #Measurement standards #Chip scale packaging #Lead #PainTài liệu tham khảo
10.1109/IEMT.1999.804791
banks, 1996, The Affects of Solder Joint Voiding on Plastic Ball Grid Array Reliability, Surface Mount International, 121
prasad, 2000, Reliability of Lead Free BGA Packages, Proceedings of IMAPS, 722
0, Cookson Semiconductor Packaging Materials, Technical Bulletin SP12 Solder Spheres
10.1109/ISAOM.2001.916565
1991, Fundamental Statistical Process Control – AIAG Reference Manual
2000
chouta, 2001, A Shear Strength Study of Pb-Free Solder Spheres for BGA Applications on Different Pad Finishes, Proceedings of the Pan Pacific Microelectronics Symposium, 11
10.1109/IEMT.1999.804792
chiu, 1997, Voiding in BGA at Solder Bumping Stage, ISHM, 462
saiyed, 0, Effect of Reflow Profile on Shear Strength of Lead Free Solder Spheres for BGA Applications
kalisz, 2001, Enhancing Yield with Solder Flux and Solder Paste Process Control, Proceedings of the Pan Pacific Microelectronics Symposium, 235