Design of multi-finger HBTs with a thermal-electrical model
Tóm tắt
Temperature distribution on the emitter fingers of heterojunction bipolar transistors (HBTs) is studied with a three-dimensional thermal-electrical model. Using this model, multi-finger HBTs is designed with non-uniform spacing. An efficient design procedure is presented. The calculated results show significant temperature reduction on non-uniform spacing devices.
Từ khóa
#Fingers #Heterojunction bipolar transistors #Temperature distribution #Electronic ballasts #Resistors #Equations #Gallium arsenide #Thermal conductivity #Electronic mail #DelayTài liệu tham khảo
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