Design for lead‐free solder joint reliability of high‐density packages
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Tài liệu tham khảo
Lau, J.H. and Pao, Y. (1997), Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw‐Hill Book Company, New York, NY.
Lau, J., Dauksher, W. and Vianco, P. (2003a), “Acceleration models, constitutive equations, and reliability of lead‐free solders and joints”, Proceedings of the 53rd IEEE Conference on Electronic Components and Technology Conference, New Orleans, pp. 229‐36.
Lau, J., Hoo, N., Horsley, R., Smetana, J., Shangguan, D., Dauksher, W., Love, W., Menis, I. and Sullivan, B. (2003b), “Reliability testing and data analysis of high‐density packages' lead‐free solder joints”, Proceedings of the IPC SMEMA Council APEX Conference, Anaheim, CA, CD‐ROM.
Lau, J., Shangguan, D., Castello, T., Horsley, R., Smetana, J., Dauksher, W., Love, D., Menis, I. and Sullivan, B. (2003c), “Failure analysis of high‐density packages' lead‐free solder joints”, Proceedings of the IPC SMEMA Council APEX Conference, Anaheim, CA, CD‐ROM.
Smetana, J., Horsley, R., Lau, J., Snowdon, K., Shangguan, D., Gleason, J., Memis, I., Love, D., Dauksher, W. and Sullivan, B. (2004), “Design, materials, and process for lead‐free assembly of high density packages”, Soldering and Surface Mount Technology, Vol. 16 No. 1.
Vianco, P. and Rejent, J. (2002), “Compression deformation response of 95.5Sn‐3.9Ag‐0.6Cu solder”, UCLA SMART Workshop on Pb‐free Solder for Electronic, Optical and MEMS Packaging Manufacturing, 5‐6 September, Los Angeles, CA, Available at: http://www.seas.ucla.edu/ethinfilm/Pb‐freeWorkshop/index.html.