Emerald
SCIE-ISI SCOPUS (1989-2025)
0954-0911
Cơ quản chủ quản: Emerald Group Publishing Ltd.
Lĩnh vực:
Materials Science (miscellaneous)Condensed Matter PhysicsElectrical and Electronic Engineering
Phân tích ảnh hưởng
Các bài báo tiêu biểu
Enhanced solder wettability of oxidized‐copper with lead‐free solder via Ar‐H2 plasmas for flip‐chip bumping: the effects of H2 flow rates
- 2012
PurposeThe purpose of this paper is to investigate the effects of H2 flow rate
on improving the solder wettability of oxidized‐copper with liquid lead‐free
solder (96.5Sn‐3Ag‐0.5Cu) by Ar‐H2 plasmas. The aim was to improve the solder
wettability of oxidized copper from 0 per cent wetting of copper oxidized in air
at 260oC for 1 hour to 100 per cent wetting of oxidized‐copper modified by Ar‐H2
plas...
Henkel Technologies enhances its Multicore® technical support team with M.O.L.E.® Technology</B>
Tập 16 Số 2 - 2004
Characterization of vapour phase soldering process zone with pressure measurements
Tập 25 Số 2 - Trang 99-106 - 2013
PurposeThe purpose of this paper is to present a novel approach on the process
zone characterization for direct feedback regarding the state of vapour, in
order to assure a better monitoring, control and understanding of the
process.Design/methodology/approachDifferent pressure sensors were applied in an
experimental vapour phase soldering (VPS) station, where the hardware setup was
dedicated to t...
Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages
- 2009
PurposeThe purpose of this paper is to assess the effect of different
temperature cycling profiles on the reliability of lead‐free 388 plastic ball
grid array (PBGA) packages and to deeply understand crack initiation and
propagation.Design/methodology/approachTemperature cycling of Sn‐3.8Ag‐0.7Cu
PBGA packages was carried out at two temperature profiles, the first ranging
between −55°C and 100°C (...