Emerald
SCIE-ISI SCOPUS (1989-2025)
0954-0911
Cơ quản chủ quản: Emerald Group Publishing Ltd.
Lĩnh vực:
Materials Science (miscellaneous)Condensed Matter PhysicsElectrical and Electronic Engineering
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Các bài báo tiêu biểu
Enhanced solder wettability of oxidized‐copper with lead‐free solder via Ar‐H2 plasmas for flip‐chip bumping: the effects of H2 flow rates
- 2012
PurposeThe purpose of this paper is to investigate the effects of H2 flow rate
on improving the solder wettability of oxidized‐copper with liquid lead‐free
solder (96.5Sn‐3Ag‐0.5Cu) by Ar‐H2 plasmas. The aim was to improve the solder
wettability of oxidized copper from 0 per cent wetting of copper oxidized in air
at 260oC for 1 hour to 100 per cent wetting of oxidized‐copper modified by Ar‐H2
plas...
Printed Electronics – Technologies and Applications, Electronics Yorkshire, 23 September 2010
Tập 23 Số 1 - 2011
New stencil printer from Speedline MPM delivers competitive price-performance ratio
Tập 12 Số 2 - 2000
Solderless Alternatives to Surface Mount Component Attachment
Tập 3 Số 2 - Trang 13-23 - 1991
Solder has been the primary method of component attachment since the early days
of radio. This tradition carries with it an overhead which becomes increasingly
expensive as the degree of miniaturisation increases. Solderless interconnect
methods, however, are often overlooked or unfairly discounted as unreliable.
Surprisingly, solderless connections can be mechanically superior to and
environmenta...