Comparison of TiN deposition by rf magnetron sputtering and electron beam sustained arc ion plating

Thin Solid Films - Tập 334 - Trang 173-177 - 1998
Shiqin Xiao1, Cristian P. Lungu1,2, Osamu Takai1
1Department of Materials Processing Engineering, Graduate School of Engineering, Nagoya University, Chikusa-ku, Nagoya 464-8603, Japan
2National Institute of Laser, Plasma and Radiation Physics, PO Box MG-36, Bucharest, Romania

Tài liệu tham khảo

Sakaki, 1994, IEEE Trans. Plasma Sci., 22, 1049, 10.1109/27.370251 Grigorov, 1991, Thin Solid Films, 198, 169, 10.1016/0040-6090(91)90335-U Brown, 1991, IEEE Trans. Plasma Sci., 19, 713, 10.1109/27.108403 Martin, 1987, J. Vac. Sci. Technol., A5, 22, 10.1116/1.574132 Sanders, 1990, IEEE Trans. Plasma Sci., 18, 883, 10.1109/27.61499 Kajioka, 1987, J. Vac. Sci. Technol., A 14, 3147 Wang, 1990, Thin Solid Films, 185, 219, 10.1016/0040-6090(90)90086-S
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Thin Solid Films

Tập 334

173-177

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