Automatic Measurement of Silicon Lattice Spacings in High-Resolution Transmission Electron Microscopy Images Through 2D Discrete Fourier Transform and Inverse Discrete Fourier Transform

Springer Science and Business Media LLC - Tập 5 - Trang 119-126 - 2022
Fang Wang1, Yushu Shi1, Shu Zhang1, Xixi Yu1,2, Wei Li1
1National Institute of Metrology, Beijing, China
2Shenzhen Institute for Technology Innovation, National Institute of Metrology, Shenzhen, China

Tóm tắt

Line width (i.e., critical dimension, CD) is a crucial parameter in integrated circuits. To accurately control the CD in manufacturing, a reasonable CD measurement algorithm is required. We develop an automatic and accurate method based on a two-dimensional discrete Fourier transform for measuring the lattice spacings from high-resolution transmission electron microscopy images. Through the two-dimensional inverse discrete Fourier transform of the central spot and a pair of symmetrical diffraction spots, an image containing only a set of lattice spacings is obtained. Then, the pixel span of the lattice spacing is calculated through the centre of gravity method. Finally, we estimate the standard CD value according to the half-intensity method. The silicon crystal lattice constant guarantees the accuracy and traceability of the CD value. Through experiments, we demonstrate the efficiency of the proposed method, which can be conveniently applied to accurately measure CDs in practical applications.

Tài liệu tham khảo

Wu ZR, Cai YN, Wang XR, Zhang LF, Deng X, Cheng XB, Li TB (2019) Amorphous Si critical dimension structures with direct Si lattice calibration. Chin Phys B 28:030601 Hoefflinger B (2011) ITRS: the international technology roadmap for semiconductors, pp 161–174. Habibullah H (2020) 30 years of atomic force microscopy: creep, hysteresis, cross-coupling, and vibration problems of piezoelectric tube scanners. Measurement 159:107776 Shi YS, Li W, Gao ST, Lu MZ, Hu XD (2018) Atomic force microscope scanning head with 3-dimensional orthogonal scanning to eliminate the curved coupling. Ultramicroscopy 190:77–80 Dai GL, Haβler-Grohne W, Huser D, Wolff H, Danzebrink H, Koenders L, Bosse H (2011) Development of a 3D-AFM for true 3D measurements of nanostructures. Meas Sci Technol 22:094009 Villarrubia JS (1997) Algorithms for scanned probe microscope image simulation, surface reconstruction, and tip estimation. J Res Natl Inst Stan 102:425–454 Dahlen G, Osborn M, Okulan N, Foreman W, Chand A, Foucher J (2005) Tip characterization and surface reconstruction of complex structures with critical dimension atomic force microscopy. J Vac Sci Technol B 23:2297–2303 Dai GL, Hahm K, Scholze F, Henn M, Gross H, Fluegge J, Bosse H (2014) Measurements of CD and sidewall profile of EUV photomask structures using CD-AFM and tilting-AFM. Meas Sci Technol 25:044002 Li YG, Zhang P, Ding ZJ (2013) Monte Carlo simulation of CD-SEM images for linewidth and critical dimension metrology. Scanning 35:127–139 Zhang P, Mao SF, Ding ZJ (2015) Monte Carlo study of the effective electron beam shape in scanning electron microscopic imaging. Eur Phys J Appl Phys 69:30703 Zou YB, Khan MSS, Li HM, Li YG, Li W, Gao ST, Liu LS, Ding ZJ (2018) Use of model-based library in critical dimension measurement by CD-SEM. Measurement 123:150–162 ISO/DIS 21466.1 (2019) Microbeam analysis - Scanning electron microscopy: method for evaluating critical dimensions by CD-SEM. International Organization for Standardization. SI Brochure – 9th edition (2019) – Appendix 2. Mise en pratique for the definition of the meter in the SI, Consultative Committee for Length. Yacoot A, Bosse H, Dixson R (2020) The lattice parameter of silicon: a secondary realisation of the metre. Meas Sci Technol 31:121001 Takamasu K, Kuwabara K, Takahashi S, Mizuno T, Kawada H (2010) Sub-nanometer calibration of CD-SEM line width by using STEM. Metrol Insp Process Control Microlithogr XXIV 7638:76381K Orji NG, Dixson RG, Garcia-Gutierrez DI, Bunday BD, Bishop M, Cresswell MW, Allen RA, Allgair JA (2007) TEM calibration methods for critical dimension standards. Metrol Insp Process Control Microlithogr XXI 6518:651810 Dai GL, Heidelmann M, Kübel C, Prang R, Fluegge J Bosse H, (2013) Reference nano-dimensional metrology by scanning transmission electron microscopy. Meas Sci Technol 24:085001 Dai GL, Fan Z, Heidelmann M, Fritz G, Bayer T, Kalt S, Fluegge J (2015) Development and characterisation of a new line width reference material. Meas Sci Technol 26:115006 Takamasu K, Okitou H, Takahashi S, Konno M, Inoue O, Kawada H (2012) Sub-nanometer calibration of line width measurement and line edge detection by using STEM and sectional SEM. Proc SPIE 8324:83240X 1–7 Takamasu K, Okitou H, Takahashi S, Konno M, Inoue O, Kawada H (2011). Sub-nanometer line width and line profile measurement for CD-SEM calibration by using STEM. Proc SPIE; 7971:797108 1–8. Dai GL, Hahm K, Bosseand H, Dixson RG (2017) Comparison of line width calibration using critical dimension atomic force microscopes between PTB and NIST. Meas Sci Technol 28:065010 Kobayashi K, Misumi I, Yamamoto K (2021) Experimental evaluation of uncertainty in sub-nanometer metrology using transmission electron microscopy due to magnification variation. Meas Sci Technol 32:095011 Meli F, Thalmann R (1998) Long-range AFM profiler used for accurate pitch measurements. Meas Sci Technol 9:1087–1092 Misumi I, Gonda S, Kurosawa T, Takamasu K (2003) Uncertainty in pitch measurements of one-dimensional grating standards using a nanometrological atomic force microscope. Meas Sci Technol 14:463–471 Dai GL, Koenders L, Pohlenz F, Dziomba T, Danzebrink H (2005) Accurate and traceable calibration of one-dimensional gratings. Meas Sci Technol 16:1241–1249