Application of higher-order FEM elements to the analysis of microstrip structures

H. Wang1, C.L. Guo1, T.H. Hubing1, J.L. Drewniak1, T.P. Van Doren1, R.E. DuBroff1
1Electromagnetic Compatibility Laboratory, Department of Electrical and Computer Engineering, University of Missouri, Rolla, Rolla, MO, USA

Tóm tắt

Microstrip structures, formed by metal traces printed on a dielectric substrate above a reference plane, are frequently the object of electromagnetic modeling. In this paper, hybrid FEM/MoM formulations employing conventional Whitney elements and newly developed linear-tangent/linear-normal (LT/LN) tangential vector finite elements (TVFEs) are applied to the analysis of microstrip structures with thin traces. This paper shows that the variation of the electric field below the trace is a significant issue to be addressed in microstrip structure modeling. Different mesh methods are investigated and the advantages of the LT/LN TVFEs are discussed.

Từ khóa

#Microstrip #Finite element methods #Solid modeling #Message-oriented middleware #Dielectric substrates #Electromagnetic modeling #Circuits #Impedance #Transmission line matrix methods #Application software

Tài liệu tham khảo

ji, 2000, EMAP5: A 3D hybrid FEM/MoM code, Appl Computat Electromagn Soc (ACES) J, 15, 1 10.1109/75.661137 10.1109/22.506446 10.1109/8.558664