Application of higher-order FEM elements to the analysis of microstrip structures
2002 IEEE International Symposium on Electromagnetic Compatibility - Tập 2 - Trang 1015-1019 vol.2
Tóm tắt
Microstrip structures, formed by metal traces printed on a dielectric substrate above a reference plane, are frequently the object of electromagnetic modeling. In this paper, hybrid FEM/MoM formulations employing conventional Whitney elements and newly developed linear-tangent/linear-normal (LT/LN) tangential vector finite elements (TVFEs) are applied to the analysis of microstrip structures with thin traces. This paper shows that the variation of the electric field below the trace is a significant issue to be addressed in microstrip structure modeling. Different mesh methods are investigated and the advantages of the LT/LN TVFEs are discussed.
Từ khóa
#Microstrip #Finite element methods #Solid modeling #Message-oriented middleware #Dielectric substrates #Electromagnetic modeling #Circuits #Impedance #Transmission line matrix methods #Application softwareTài liệu tham khảo
ji, 2000, EMAP5: A 3D hybrid FEM/MoM code, Appl Computat Electromagn Soc (ACES) J, 15, 1
10.1109/75.661137
10.1109/22.506446
10.1109/8.558664
