Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor

Microelectronics Reliability - Tập 137 - Trang 114742 - 2022
Daniel Riegel1, Przemyslaw Jakub Gromala1, Sven Rzepka2
1Robert Bosch GmbH, 72770 Reutlingen, Germany
2Fraunhofer ENAS, 09126 Chemnitz, Germany

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