A full-field warpage characterization measurement method coupled with infrared information

Microelectronics Reliability - Tập 149 - Trang 115237 - 2023
Baoshan Zeng1, Yuhan Gao1, Chuanguo Xiong1, Xin Lei1, Weishan Lv1, Fulong Zhu1
1Institute of Microsystems, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan, Hubei Province 430074, PR China

Tài liệu tham khảo

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