A comparative study of RF noise characteristics of different submicron SOI MOSFET structures on SIMOX technology

Sang Lam1, Hongmei Wang2, Wai-Kit Lee1, P.K. Ko1, Mansun Chan1
1Dept. of Electrical and Electronic Engineering, Hong Kong University of Sci. & Tech., Hong Kong, Hong Kong, China
2Dept. of Electrical and Electronic Engineering, Hong Kong University of Sci. & Tech., Hong Kong

Tóm tắt

The silicon-on-insulator (SOI) CMOS technology has been attractive for radio frequency (RF) integrated circuits due to its advantages of reduced parasitic capacitance, minimal substrate loss and noise coupling, and monolithic integration of high-Q passive components. However, there are various choices of SOI device structures such as fully depleted (FD), partially depleted (PD) and dynamic threshold (DT) MOSFET's. While the relative merits of the SOI devices in terms of current driving capability, small-signal gain and maximum cut-off frequencies have been extensively studied, the direct comparisons of their noise performance at gigahertz frequencies are very few in the literature. In order to fill the gap, we have performed extensive RF noise characterizations of the common SOI devices together with the effects of scaling, body contact scheme, and operation conditions.

Từ khóa

#Radio frequency #MOSFET circuits #Integrated circuit noise #CMOS technology #Silicon on insulator technology #Integrated circuit technology #Monolithic integrated circuits #Cutoff frequency #CMOS integrated circuits #Radiofrequency integrated circuits

Tài liệu tham khảo

ng, 1996, IEEE Transactions on Electron Devices, 43, 2308, 10.1109/16.536822 10.1109/16.830992 10.1109/16.766881