Growth competition between layer-type and porous-type Cu 3 Sn in microbumps
Tài liệu tham khảo
Panchenko, 2014, Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects, Microelectron. Eng., 117, 26, 10.1016/j.mee.2013.12.003
Chih Chen, 2015, Vertical interconnects of microbumps in 3D integration, MRS Bull., 40, 257, 10.1557/mrs.2015.29
Lin, 2016, Formation mechanism of porous Cu3Sn intermetallic compounds by high current stressing at high temperatures in low-bump-height solder joints, Crystals, 6
Wang, 2016, Porous Cu3Sn formation in Cu-Sn IMC-based micro-joints, IEEE ECTC Proc., 439
Hoglund, 2001, Analysis of the Kirkendall effect, marker migration and pore formation, Acta Mater., 49, 1311, 10.1016/S1359-6454(01)00054-4
Strandlund, 2004, Prediction of Kirkendall shift and porosity in binary and ternary diffusion couples, Acta Mater., 52, 4695, 10.1016/j.actamat.2004.06.039
Zeng, 2005, Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability, J. Appl. Phys., 97, 10.1063/1.1839637
Gusak, 2016, Flux-driven cellular precipitation in open system to form porous Cu3Sn, Philos. Mag., 96, 1318, 10.1080/14786435.2016.1162913
Kawakatsu, 1972, On the growth of alloy layer between solid copper and liquid tin, Trans. JIM, 13, 436, 10.2320/matertrans1960.13.436
Vianco, 2004, Solid-state intermetallic compound layer growth between copper and 95.5 Sn-3.9 Ag-0.6 Cu solder, J. Electron. Mater., 33, 991, 10.1007/s11664-004-0026-9
Yin, 2006, Energy-tunable transmission x-ray microscope for differential contrast imaging with near 60nm resolution tomography, Appl. Phys. Lett., 88, 10.1063/1.2211300
Song, 2007, X-ray beamline for structural studies at the NSRRC superconducting wavelength shifter, J. Synchrotron Radiat., 14, 320, 10.1107/S0909049507021516
Liang, 2012, Side-wall wetting induced void formation due to small solder volume in microbumps of Ni/SnAg/Ni upon reflow, ECS Solid State Lett., 1, 60, 10.1149/2.002204ssl