Growth competition between layer-type and porous-type Cu 3 Sn in microbumps

Microelectronics Reliability - Tập 79 - Trang 32-37 - 2017
David T. Chu1, Yi-Cheng Chu2, Jie-An Lin2, Yi-Ting Chen1, Chun-Chieh Wang3, Yen-Fang Song3, Cheng-Cheng Chiang3, Chih Chen2, K.N. Tu1
1Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, California 90095-1595, United States
2Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan, Republic of China
3National Synchrotron Radiation Research Center, Hsinchu 30076, Taiwan, Republic of China

Tài liệu tham khảo

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