Growth competition between layer-type and porous-type Cu 3 Sn in microbumps

Microelectronics Reliability - Tập 79 - Trang 32-37 - 2017
David T. Chu1, Yi-Cheng Chu2, Jie-An Lin2, Yi-Ting Chen1, Chun-Chieh Wang3, Yen-Fang Song3, Cheng-Cheng Chiang3, Chih Chen2, K.N. Tu1
1Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, California 90095-1595, United States
2Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan, Republic of China
3National Synchrotron Radiation Research Center, Hsinchu 30076, Taiwan, Republic of China

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Microelectronics Reliability

Tập 79

32-37

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