Flux-underfill compatibility and failure mode analysis in high yield flip chip processing
Tóm tắt
The compatibility of flux and underfill material systems significantly contributes to the formation and growth of process-induced defects and further influences flip chip reliability. Various no-clean fluxes, along with a water-soluble flux used as the baseline, are tested with two fast flow, snap cure underfills. Liquid-to-liquid thermal shock and temperature and humidity tests are conducted to evaluate the reliability of each flux-underfill material system. The failure modes, specifically underfill delamination, solder fatigue, and die cracking, are identified and analyzed. The correlation among process manufacturing defects, failure modes, and long-term reliability are determined. Understanding these failure modes will further enable and facilitate the implementation of low cost, high yield flip chip processing in standard surface mount technology.
Từ khóa
#Failure analysis #Flip chip #Conducting materials #Materials reliability #Thermal conductivity #Electric shock #Temperature #Humidity #Materials testing #System testingTài liệu tham khảo
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