Load transfer and deformation mechanisms in carbon nanotube-polystyrene composites

Applied Physics Letters - Tập 76 Số 20 - Trang 2868-2870 - 2000
Dong Qian1, Elizabeth C. Dickey1, Rodney Andrews2, Terry D. Rantell2
1Department of Chemical and Materials Engineering, University of Kentucky, Lexington, Kentucky 40506
2Center for Applied Energy Research, University of Kentucky, Lexington, Kentucky 40511

Tóm tắt

Multiwall carbon nanotubes have been dispersed homogeneously throughout polystyrene matrices by a simple solution-evaporation method without destroying the integrity of the nanotubes. Tensile tests on composite films show that 1 wt % nanotube additions result in 36%–42% and ∼25% increases in elastic modulus and break stress, respectively, indicating significant load transfer across the nanotube-matrix interface. In situ transmission electron microscopy studies provided information regarding composite deformation mechanisms and interfacial bonding between the multiwall nanotubes and polymer matrix.

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Tài liệu tham khảo

1996, Nature (London), 381, 678, 10.1038/381678a0

1997, Science, 277, 1971, 10.1126/science.277.5334.1971

1999, Science, 283, 1513, 10.1126/science.283.5407.1513

1997, Am. Sci., 85, 324

1999, Polymer, 40, 5967, 10.1016/S0032-3861(99)00166-4

1999, Adv. Mater., 11, 1281, 10.1002/(SICI)1521-4095(199910)11:15<1281::AID-ADMA1281>3.0.CO;2-6

1999, Chem. Phys. Lett., 303, 467, 10.1016/S0009-2614(99)00282-1

1999, Chem. Phys. Lett., 315, 25, 10.1016/S0009-2614(99)01216-6

1994, Science, 265, 1212, 10.1126/science.265.5176.1212

1998, Appl. Phys. Lett., 73, 3842, 10.1063/1.122911

1998, Appl. Phys. Lett., 73, 3527, 10.1063/1.122825

1998, Phys. Rev. Lett., 81, 1638, 10.1103/PhysRevLett.81.1638

1998, Appl. Phys. Lett., 72, 188, 10.1063/1.120680

1998, Appl. Phys. Lett., 73, 1197, 10.1063/1.122125

1999, Appl. Phys. Lett., 74, 3317, 10.1063/1.123330

1996, Carbon, 34, 814, 10.1016/0008-6223(96)89470-X

2000, Science, 287, 637, 10.1126/science.287.5453.637

1999, Appl. Phys. Lett., 74, 3152, 10.1063/1.124094

1999, J. Mater. Res., 14, 2871, 10.1557/JMR.1999.0383