Wafer bonding technique used for the integration of cubic GaN/GaAs (001) with Si substrateScience in China Series E: Technological Sciences - Tập 45 - Trang 255-260 - 2002
Yuanping Sun, Fu Yi, Qu Bo, Wang Yutian, Feng Zhihong, Shen Xiaoming, Zhao Degang, Zheng Xinhe, Duan Lihong, Li Bingchen, Zhang Shuming, Yang Hui, Jiang Xiaoming, Zheng Wenli, Jia Quanjie