Science in China Series E: Technological Sciences

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Characteristic of solid product layer of MgSO4 in the reaction of MgO with SO2
Science in China Series E: Technological Sciences - Tập 53 - Trang 1869-1876 - 2010
ZhenShan Li, Fan Fang, NingSheng Cai
Determination of effective thermal conductivity for polyurethane foam by use of fractal method
Science in China Series E: Technological Sciences - Tập 49 - Trang 468-475 - 2006
Mingheng Shi, Xiaochuan Li, Yongping Chen
Design and experimental study of the SPKM165, a five-axis serial-parallel kinematic milling machine
Science in China Series E: Technological Sciences - Tập 54 - Trang 1193-1205 - 2011
FuGui Xie, XinJun Liu, Hui Zhang, JinSong Wang
A novel random phase-shifting digital holographic microscopy method
Science in China Series E: Technological Sciences - Tập 52 - Trang 2048-2053 - 2009
HuiMin Xie, ZhenXing Hu, FuLong Dai, YanJie Li, PengWan Chen, QingMing Zhang, FengLei Huang
Monte Carlo simulations of dense gas flow and heat transfer in micro- and nano-channels
Science in China Series E: Technological Sciences - - 2005
Moran Wang, Zhixin Li
Anisotropic plastic deformation behavior of as-extruded ZK60 magnesium alloy at room temperature
Science in China Series E: Technological Sciences - Tập 52 - Trang 161-165 - 2009
JinBao Lin, LiMing Peng, QuDong Wang, J. R. Hans, WenJiang Ding
Recent progress in thermodynamics of radiation—exergy of radiation, effective temperature of photon and entropy constant of photon
Science in China Series E: Technological Sciences - Tập 51 - Trang 1096-1109 - 2008
ZeShao Chen, SongPing Mo, Peng Hu
Influence of growth pressure of a GaN buffer layer on the properties of MOCVD GaN
Science in China Series E: Technological Sciences - - 2003
Jun Chen, Shuming Zhang, Baoshun Zhang, Jianjun Zhu, Feng Ge, Li Duan, Yutian Wang, Hui Yang, Wenxu Zheng
Analysis of the constraint relation between ground and self-adaptive mobile mechanism of a transformable wheel-track robot
Science in China Series E: Technological Sciences - Tập 54 - Trang 610-624 - 2011
ZhiQing Li, ShuGen Ma, Bin Li, MingHui Wang, YueChao Wang
Wafer bonding technique used for the integration of cubic GaN/GaAs (001) with Si substrate
Science in China Series E: Technological Sciences - Tập 45 - Trang 255-260 - 2002
Yuanping Sun, Fu Yi, Qu Bo, Wang Yutian, Feng Zhihong, Shen Xiaoming, Zhao Degang, Zheng Xinhe, Duan Lihong, Li Bingchen, Zhang Shuming, Yang Hui, Jiang Xiaoming, Zheng Wenli, Jia Quanjie
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