Frontiers of Energy and Power Engineering in China
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Liquid metal cooling in thermal management of computer chips
Tập 1 - Trang 384-402 - 2007
With the rapid improvement of computer performance, tremendous heat generation in the chip becomes a major serious concern for thermal management. Meanwhile, CPU chips are becoming smaller and smaller with almost no room for the heat to escape. The total power-dissipation levels now reside on the order of 100 W with a peak power density of 400–500 W/cm2, and are still steadily climbing. As a resul......
Development and demonstration plant operation of an opposed multi-burner coal-water slurry gasification technology
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A district heating system based on absorption heat exchange with CHP systems
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