Frontiers of Energy and Power Engineering in China
SCOPUS (2007-2011)
1673-7504
1673-7393
Cơ quản chủ quản: N/A
Phân tích ảnh hưởng
Các bài báo tiêu biểu
Liquid metal cooling in thermal management of computer chips
Tập 1 - Trang 384-402 - 2007
With the rapid improvement of computer performance, tremendous heat generation
in the chip becomes a major serious concern for thermal management. Meanwhile,
CPU chips are becoming smaller and smaller with almost no room for the heat to
escape. The total power-dissipation levels now reside on the order of 100 W with
a peak power density of 400–500 W/cm2, and are still steadily climbing. As a
resul...
Development and demonstration plant operation of an opposed multi-burner coal-water slurry gasification technology
Tập 1 Số 3 - Trang 251-258 - 2007
A district heating system based on absorption heat exchange with CHP systems
Tập 4 Số 1 - Trang 77-83 - 2010
Numerical study on natural convection in a square enclosure containing a rectangular heated cylinder
- 2009