L. X. Qian1,2, Zehan Wu1,2, Yi‐Yu Zhang1,2, P. T. Lai3, Xingzhao Liu1,2, Yanrong Li1,2
1School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, 610054, China
2State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, China
3Department of Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong, Hong Kong