Ultra deep trench doping in silicon by grazing incident boron implantation

Elsevier BV - Tập 257 - Trang 275-278 - 2007
S. Nizou1,2, M. Ziti1, C. Dubois3, M. Roy2, D. Alquier1
1Université François Rabelais, Tours, L.M.P, 16, rue Pierre et Marie Curie, B.P. 7155, F37071 TOURS Cedex, France
2STMicroelectronics, 16, rue Pierre et Marie Curie, B.P. 7155, F37071 TOURS Cedex, France
3L.P.M. – INSA Lyon, 20, rue A. Einstein, F-69621 Villeurbanne Cedex, France

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